Inventor · disambiguated record

Yun-Hyoek Im

Also filed as: IM YUN-HYOEK

1 granted patent·2 citations·filing 2013–2013

19Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0162US9054067B2Semiconductor package with thermal dissipating member and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims

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