Inventor · disambiguated record
John Hon-Shing Lau
Also filed as: LAU JOHN H · LAU JOHN H W · LAU JOHN HON-SHING
34 granted patents·19 pending applications·898 citations·filing 1977–2025
97Inventor score
Files withUNIMICRON TECHNOLOGY CORP30CANADIAN PATENTS DEV3EXPRESS PACKAGING SYSTEMS INC3CHEN JUI-CHIN2IND TECH RES INST2
Top patents by PatentIndex Score
53 records- 0198US6075710ALow-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chipsEXPRESS PACKAGING SYSTEMS INC·Filed 1999·Granted Jun 13, 2000·252 cites·14 claims
- 0295US11516910B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·4 cites·10 claims
- 0394US12309943B2Circuit carrier and manufacturing method thereof and package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·2 cites·17 claims
- 0494US6057601AHeat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrateEXPRESS PACKAGING SYSTEMS INC·Filed 1998·Granted May 2, 2000·242 cites·20 claims
- 0592US12412879B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Sep 9, 2025·1 cites·13 claims
- 0692US11808787B2Probe card testing deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 7, 2023·3 cites·13 claims
- 0792US9385056B2Packaging substrate having embedded interposer and fabrication method thereofHU DYI-CHUNG·Filed 2012·Granted Jul 5, 2016·15 cites·2 claims
- 0892US4752946AGas discharge derived annular plasma pinch x-ray sourceCANADIAN PATENTS DEV·Filed 1986·Granted Jun 21, 1988·108 cites·16 claims
- 0991US4751723AMultiple vacuum arc derived plasma pinch x-ray sourceCANADIAN PATENTS DEV·Filed 1986·Granted Jun 14, 1988·96 cites·11 claims
- 1090US5825084ASingle-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devicesEXPRESS PACKAGING SYSTEMS INC·Filed 1997·Granted Oct 20, 1998·117 cites·22 claims
- 1185US8456017B2Filled through-silicon via with conductive composite materialDAI MING-JI·Filed 2011·Granted Jun 4, 2013·10 cites·20 claims
- 1284US9252054B2Thinned integrated circuit device and manufacturing process for the sameIND TECH RES INST·Filed 2014·Granted Feb 2, 2016·7 cites·18 claims
- 1383US8674491B2Semiconductor deviceLIU CHUN-KAI·Filed 2011·Granted Mar 18, 2014·7 cites·23 claims
- 1478US11445617B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 13, 2022·2 cites·13 claims
- 1578US2025227857A1Manufacturing method of circuit carrierUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1677US8519524B1Chip stacking structure and fabricating method of the chip stacking structureWU SHENG-TSAI·Filed 2012·Granted Aug 27, 2013·6 cites·31 claims
- 1772US12266616B2Integrated circuit package structureUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Apr 1, 2025·0 cites·4 claims
- 1867US12414243B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·10 claims
- 1967US8502224B2Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensorTAIN RA-MIN·Filed 2010·Granted Aug 6, 2013·2 cites·19 claims
- 2064US11562972B2Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive elementUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jan 24, 2023·0 cites·10 claims
- 2164US4142089APulsed coaxial thermal plasma sprayerCANADIAN PATENTS DEV·Filed 1977·Granted Feb 27, 1979·19 cites·5 claims
- 2264US2023067112A1Vapor chamber structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2363US8397584B2Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatusHSIEH MING-CHE·Filed 2011·Granted Mar 19, 2013·1 cites·12 claims
- 2462US2025149503A1Package structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2561US2025323232A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2661US2024248264A1Package structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2760US2025147249A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2860US2025125298A1Chip package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2959US11824012B2Integrated circuit package structure and method of manufacturing the sameUNIMICRON TECH CORPORATION·Filed 2020·Granted Nov 21, 2023·0 cites·7 claims
- 3058US12243838B2Circuit substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 4, 2025·0 cites·15 claims
- 3158US8536701B2Electronic device packaging structureTAIN RA-MIN·Filed 2012·Granted Sep 17, 2013·1 cites·12 claims
- 3257US11860428B1Package structure and optical signal transmitterUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jan 2, 2024·0 cites·9 claims
- 3357US2021247147A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 3457US2024234371A1Chip package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 3553US11145610B2Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Oct 12, 2021·0 cites·8 claims
- 3653US8673658B2Fabricating method of semiconductor deviceIND TECH RES INST·Filed 2013·Granted Mar 18, 2014·0 cites·11 claims
- 3752US11410933B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·10 claims
- 3851US2023163074A1Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3949US11710690B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4048US11682612B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 20, 2023·0 cites·8 claims
- 4148US11665832B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 4248US11540396B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Dec 27, 2022·0 cites·5 claims
- 4348US2012322249A1Manufacturing method of semiconductor structureCHEN JUI-CHIN·Filed 2012·Application pending·0 cites
- 4448US2022069489A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 4548US2022328387A1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 4647US2022071000A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 4745US2012119375A1Semiconductor structure and manufacturing method thereofCHEN JUI-CHIN·Filed 2010·Application pending·0 cites
- 4844US2021251107A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 4942US2012249176A1Test structure and measurement method thereofCHIEN HENG-CHIEH·Filed 2011·Application pending·0 cites
- 5037US9583366B2Thermally-enhanced provision of underfill to electronic devices using a stencilASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Feb 28, 2017·0 cites·16 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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