Inventor · disambiguated record
Colby Greg Rampley
Also filed as: RAMPLEY COLBY · RAMPLEY COLBY G · RAMPLEY Colby Greg
13 granted patents·5 pending applications·182 citations·filing 2000–2023
90Inventor score
Top patents by PatentIndex Score
18 records- 0196US6893947B2Advanced RF enhancement-mode FETs with improved gate propertiesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted May 17, 2005·124 cites·23 claims
- 0288US9941210B1Semiconductor devices with protruding conductive vias and methods of making such devicesNXP USA INC·Filed 2016·Granted Apr 10, 2018·7 cites·26 claims
- 0385US9111983B1Methods for removing adhesive layers from semiconductor wafersGINTER KEVIN P·Filed 2014·Granted Aug 18, 2015·24 cites·20 claims
- 0479US10741446B2Method of wafer dicing for wafers with backside metallization and packaged diesNXP USA INC·Filed 2017·Granted Aug 11, 2020·2 cites·20 claims
- 0578US10340251B2Method for making an electronic component packageNXP USA INC·Filed 2017·Granted Jul 2, 2019·3 cites·18 claims
- 0673US10014262B2Method of wafer dicing for backside metallizationFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jul 3, 2018·3 cites·8 claims
- 0770US8742599B2Identification mechanism for semiconductor device dieRAMPLEY COLBY G·Filed 2012·Granted Jun 3, 2014·3 cites·11 claims
- 0867US10998231B2Method for increasing semiconductor device wafer strengthNXP USA INC·Filed 2019·Granted May 4, 2021·1 cites·16 claims
- 0967US6798064B1Electronic component and method of manufactureMOTOROLA INC·Filed 2000·Granted Sep 28, 2004·15 cites·16 claims
- 1065US12362294B2Wafer with semiconductor devices and integrated electrostatic discharge protectionNXP USA INC·Filed 2021·Granted Jul 15, 2025·0 cites·14 claims
- 1162US11437276B2Packaged dies with metal outer layers extending from die back sides toward die front sidesNXP USA INC·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 1259US2014238483A1Three-dimensional solar cell having increased efficiencyRAMPLEY COLBY G·Filed 2014·Application pending·0 cites
- 1355US8790947B2Three-dimensional solar cell having increased efficiencyRAMPLEY COLBY G·Filed 2011·Granted Jul 29, 2014·0 cites·8 claims
- 1453US2025006802A1Transistors with recessed field plates and methods of fabrication thereofNXP USA INC·Filed 2023·Application pending·0 cites
- 1553US2025006818A1Transistors with dielectric spacers and methods of fabrication thereofNXP USA INC·Filed 2023·Application pending·0 cites
- 1648US2014232017A1Identification mechanism for semiconductor device dieRAMPLEY COLBY G·Filed 2014·Application pending·0 cites
- 1742US11387373B2Low drain-source on resistance semiconductor component and method of fabricationNXP USA INC·Filed 2019·Granted Jul 12, 2022·0 cites·25 claims
- 1831US2018059290A1Aluminum nitride protection of silver apparatus, system and methodFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
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