Inventor · disambiguated record

Jung-Hua Wei

Also filed as: WEI JUNG-HUA

1 granted patent·11 citations·filing 2005–2005

33Inventor score

Technology areasC25D

Files withIND TECH RES INST1

Top patents by PatentIndex Score

1 record

0185US7226531B2Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubesIND TECH RES INST·Filed 2005·Granted Jun 5, 2007·11 cites·12 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →