Inventor · disambiguated record
Seiya Isozaki
Also filed as: ISOZAKI SEIYA
8 granted patents·1 pending application·43 citations·filing 1996–2024
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0177US11387172B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Jul 12, 2022·3 cites·18 claims
- 0274US7994614B2Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 9, 2011·6 cites·15 claims
- 0370US6400034B1Semiconductor deviceNEC CORP·Filed 2000·Granted Jun 4, 2002·20 cites·18 claims
- 0463US10181450B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jan 15, 2019·1 cites·8 claims
- 0561US2025149410A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0641US6608384B2Semiconductor device and method of forming the sameNEC CORP·Filed 2001·Granted Aug 19, 2003·1 cites·1 claims
- 0741US5610440ASemiconductor devide having improved junction construction between heat radiation plate and ceramic substrateNEC CORP·Filed 1996·Granted Mar 11, 1997·12 cites·3 claims
- 0840US11211349B2Semiconductor device including a plurality of bonding padsRENESAS ELECTRONICS CORP·Filed 2020·Granted Dec 28, 2021·0 cites·23 claims
- 0940US10347604B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →