Inventor · disambiguated record

Pao-Yi Huang

Also filed as: HUANG PAO-YI

1 granted patent·2 pending applications·0 citations·filing 2019–2024

10Inventor score

Technology areasH10W

Files withSANDISK TECHNOLOGIES INC2 WESTERN DIGITAL TECH INC1

Top patents by PatentIndex Score

3 records

0154US2025300128A1Symmetrical semiconductor dies for a semiconductor packageSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
0253US2025293218A1Semiconductor package having an integrated passive device that acts as a spacerSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
0339US11094673B2Stacked die package with curved spacerWESTERN DIGITAL TECH INC·Filed 2019·Granted Aug 17, 2021·0 cites·19 claims

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