Inventor · disambiguated record
Tung-Sheng Lai
Also filed as: LAI TUNG-SHENG
1 granted patent·2 pending applications·2 citations·filing 2011–2015
18Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0149US9559265B2Flip-chip LED, method for manufacturing the same and flip-chip package of the sameMAO BANG ELECTRONIC CO LTD·Filed 2015·Granted Jan 31, 2017·2 cites·8 claims
- 0221US2015235978A1Electroless nickel bump of die pad and manufacturing method thereofAFLASH TECHNOLOGY CO LTD·Filed 2012·Application pending·0 cites
- 0317US2011291291A1Silicon Chip Having Penetrative Connection HolesLAI TUNG-SHENG·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →