Inventor · disambiguated record
Alice Boussagol
Also filed as: BOUSSAGOL ALICE
11 granted patents·2 pending applications·172 citations·filing 2003–2010
90Inventor score
Top patents by PatentIndex Score
13 records- 0193US7839001B2Methods for making substrates and substrates formed therefromSOITEC SILICON ON INSULATOR·Filed 2009·Granted Nov 23, 2010·15 cites·12 claims
- 0289US7939428B2Methods for making substrates and substrates formed therefromSOITEC SILICON ON INSULATOR·Filed 2010·Granted May 10, 2011·7 cites·20 claims
- 0389US7615468B2Methods for making substrates and substrates formed therefromSOITEC SILICON ON INSULATOR·Filed 2007·Granted Nov 10, 2009·12 cites·25 claims
- 0486US7557324B2Backstream-preventing thermal spraying deviceVOLVO AERO CORP·Filed 2003·Granted Jul 7, 2009·73 cites·16 claims
- 0584US7326628B2Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughnessSOITEC SILICON ON INSULATOR·Filed 2005·Granted Feb 5, 2008·18 cites·16 claims
- 0682US6858517B2Methods of producing a heterogeneous semiconductor structureSOITEC SILICON ON INSULATOR·Filed 2004·Granted Feb 22, 2005·31 cites·19 claims
- 0776US7514341B2Finishing process for the manufacture of a semiconductor structureSOITEC SILICON ON INSULATOR·Filed 2006·Granted Apr 7, 2009·8 cites·16 claims
- 0859US9011598B2Method for making a composite substrate and composite substrate according to the methodBOUSSAGOL ALICE·Filed 2006·Granted Apr 21, 2015·3 cites·9 claims
- 0954US7135383B2Composite structure with high heat dissipationSOITEC SILICON ON INSULATOR·Filed 2004·Granted Nov 14, 2006·5 cites·20 claims
- 1049US7256473B2Composite structure with high heat dissipationSOITEC SILICON ON INSULATOR·Filed 2006·Granted Aug 14, 2007·0 cites·16 claims
- 1147US8679942B2Strain engineered composite semiconductor substrates and methods of forming sameLETERTRE FABRICE·Filed 2009·Granted Mar 25, 2014·0 cites·32 claims
- 1247US2007141803A1Methods for making substrates and substrates formed therefromBOUSSAGOL ALICE·Filed 2006·Application pending·0 cites
- 1334US2006284252A1Process for holding strain in an island etched in a strained thin layer and structure obtained by implementation of this processBOUSSAGOL ALICE·Filed 2005·Application pending·0 cites
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