Inventor · disambiguated record
Tomoyasu Murakami
Also filed as: MURAKAMI TOMOYASU
24 granted patents·1 pending application·511 citations·filing 1992–2018
96Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD9YAZAKI CORP9PANASONIC CORP4MATSUSHITA ELECTRONICS CORP1MURAKAMI TOMOYASU1
Top patents by PatentIndex Score
25 records- 0190US7347733B2Electric junction boxYAZAKI CORP·Filed 2006·Granted Mar 25, 2008·20 cites·1 claims
- 0289US6012967APolishing method and polishing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 11, 2000·114 cites·32 claims
- 0387US5709249ALocking structureYAZAKI CORP·Filed 1995·Granted Jan 20, 1998·70 cites·3 claims
- 0480US10305203B2Bus bar and method of manufacturing bus barYAZAKI CORP·Filed 2018·Granted May 28, 2019·4 cites·16 claims
- 0580US7731862B2Dry etching method, fine structure formation method, mold and mold fabrication methodPANASONIC CORP·Filed 2006·Granted Jun 8, 2010·9 cites·27 claims
- 0680US5576247AThin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moistureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Nov 19, 1996·71 cites·3 claims
- 0777US7919005B2Dry etching method, fine structure formation method, mold and mold fabrication methodPANASONIC CORP·Filed 2006·Granted Apr 5, 2011·4 cites·18 claims
- 0876US7906030B2Dry etching method, fine structure formation method, mold and mold fabrication methodPANASONIC CORP·Filed 2006·Granted Mar 15, 2011·4 cites·18 claims
- 0974US7758761B2Dry etching method, fine structure formation method, mold and mold fabrication methodPANASONIC CORP·Filed 2006·Granted Jul 20, 2010·4 cites·33 claims
- 1071US7109421B2Harness holder and harness layout structure therebyYAZAKI CORP·Filed 2004·Granted Sep 19, 2006·18 cites·8 claims
- 1170US10122159B2Electric connection boxYAZAKI CORP·Filed 2017·Granted Nov 6, 2018·2 cites·10 claims
- 1268US7614915B2Wire harness water cut-off structureYAZAKI CORP·Filed 2007·Granted Nov 10, 2009·8 cites·9 claims
- 1368US5385867AMethod for forming a multi-layer metallic wiring structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jan 31, 1995·40 cites·7 claims
- 1467US7189930B2GrommetYAZAKI CORP·Filed 2006·Granted Mar 13, 2007·5 cites·4 claims
- 1567US5834369AMethod of preventing diffusion between interconnect and plugMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Nov 10, 1998·35 cites·18 claims
- 1660US5866480AMethod and apparatus for polishing semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Feb 2, 1999·21 cites·10 claims
- 1759US5312776AMethod of preventing the corrosion of metallic wiringsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted May 17, 1994·28 cites·9 claims
- 1858US6099390APolishing pad for semiconductor wafer and method for polishing semiconductor waferMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Aug 8, 2000·19 cites·16 claims
- 1951US6074289AApparatus for holding substrate to be polishedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 13, 2000·18 cites·11 claims
- 2050US2007093575A1Anaerobic adhesive compositions and water-blocking treatment of electrical wires with the same compositionsMURAKAMI TOMOYASU·Filed 2004·Application pending·0 cites
- 2145US10717143B2Vapor-phase type heating method and vapor-phase type heating apparatusPANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·8 claims
- 2242US5569628ASemiconductor device fabrication methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Oct 29, 1996·10 cites·13 claims
- 2337US10651640B2Grommet and wire harness using the sameYAZAKI CORP·Filed 2015·Granted May 12, 2020·0 cites·15 claims
- 2436US6251000B1Substrate holder, method for polishing substrate, and method for fabricating semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jun 26, 2001·7 cites·5 claims
- 2532US10211613B2Protective tube attaching methodYAZAKI CORP·Filed 2016·Granted Feb 19, 2019·0 cites·6 claims
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