Inventor · disambiguated record
William Reeder
Also filed as: REEDER WILLIAM J · REEDER WILLIAM JEFFERY
10 granted patents·1 pending application·210 citations·filing 2000–2007
90Inventor score
Top patents by PatentIndex Score
11 records- 0194US6984545B2Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder maskMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 10, 2006·72 cites·28 claims
- 0292US7125748B2Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder maskMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 24, 2006·21 cites·33 claims
- 0392US6577004B1Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·75 cites·46 claims
- 0477US6577019B1Alignment and orientation features for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·20 cites·19 claims
- 0569US7138724B2Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder maskMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 21, 2006·11 cites·17 claims
- 0665US7767557B2Chilled wafer dicingMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 3, 2010·2 cites·5 claims
- 0759US7229905B2Alignment and orientation features for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 12, 2007·1 cites·8 claims
- 0859US6869869B2Alignment and orientation features for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 22, 2005·7 cites·8 claims
- 0950US7417294B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 26, 2008·0 cites·30 claims
- 1050US2006205117A1Solder masks used in encapsulation, assemblies including the solar mask, and methodsGRIGG FORD B·Filed 2006·Application pending·0 cites
- 1145US7416913B2Methods of manufacturing microelectronic imaging units with discrete standoffsMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 26, 2008·1 cites·44 claims
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