Inventor · disambiguated record
Saihsi Jen
Also filed as: JEN SAIHSI
2 granted patents·1 citations·filing 2011–2013
35Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0152US8455989B2Package substrate having die pad with outer raised portion and interior recessed portionHO CHIH-CHIEN·Filed 2011·Granted Jun 4, 2013·1 cites·9 claims
- 0247US8546184B2Package substrate having die pad with outer raised portion and interior recessed portionTEXAS INSTRUMENTS INC·Filed 2013·Granted Oct 1, 2013·0 cites·6 claims
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