Inventor · disambiguated record
Erwin B. Cohen
Also filed as: COHEN ERWIN · COHEN ERWIN B
13 granted patents·2 pending applications·101 citations·filing 2003–2023
88Inventor score
Top patents by PatentIndex Score
15 records- 0191US7127560B2Method of dynamically controlling cache sizeIBM·Filed 2003·Granted Oct 24, 2006·81 cites·15 claims
- 0286US11830810B2Packaged transistor having die attach materials with channels and process of implementing the sameWOLFSPEED INC·Filed 2020·Granted Nov 28, 2023·2 cites·22 claims
- 0377US11424177B2Integrated circuit having die attach materials with channels and process of implementing the sameCREE INC·Filed 2020·Granted Aug 23, 2022·1 cites·34 claims
- 0473US9633914B2Split ball grid array pad for multi-chip modulesIBM·Filed 2015·Granted Apr 25, 2017·2 cites·6 claims
- 0567US7759168B2Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lidIBM·Filed 2008·Granted Jul 20, 2010·5 cites·1 claims
- 0664US8806742B2Method of making an electronic packageCOHEN ERWIN B·Filed 2009·Granted Aug 19, 2014·3 cites·1 claims
- 0763US10886198B2Robust electronics mounting deviceCREE INC·Filed 2020·Granted Jan 5, 2021·0 cites·16 claims
- 0859US7106110B2Clock dithering system and method during frequency scalingIBM·Filed 2004·Granted Sep 12, 2006·7 cites·20 claims
- 0956US10720379B2Robust integrated circuit packageCREE INC·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 1056US2024079320A1Packaged transistor with channeled die attach materials and process of implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1152US12315836B2Limiting failures caused by dendrite growth on semiconductor chipsWOLFSPEED INC·Filed 2022·Granted May 27, 2025·0 cites·29 claims
- 1248US10483233B2Split ball grid array pad for multi-chip modulesIBM·Filed 2017·Granted Nov 19, 2019·0 cites·17 claims
- 1342US9059552B2Land grid array (LGA) socket cartridge and method of formingIBM·Filed 2013·Granted Jun 16, 2015·0 cites·10 claims
- 1442US2008195986A1Power grid tuning for dc voltage equalizationIBM·Filed 2007·Application pending·0 cites
- 1539US8756546B2Elastic modulus mapping of a chip carrier in a flip chip packageCOHEN ERWIN B·Filed 2012·Granted Jun 17, 2014·0 cites·5 claims
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