Inventor · disambiguated record
Dirk Brown
Also filed as: BROWN DIRK · BROWN DIRK D · BROWN DIRK DEWAR
40 granted patents·5 pending applications·2,742 citations·filing 1998–2023
99Inventor score
Files withADVANCED MICRO DEVICES INC20NEOCONIX INC8PANDOODLE CORP7HIGH CONNECTION DENSITY INC4BROWN DIRK D2
Top patents by PatentIndex Score
45 records- 0198US6344410B1Manufacturing method for semiconductor metalization barrierADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 5, 2002·292 cites·8 claims
- 0298US6144099ASemiconductor metalization barrierADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 7, 2000·319 cites·6 claims
- 0396US7628617B2Structure and process for a contact grid array formed in a circuitized substrateNEOCONIX INC·Filed 2006·Granted Dec 8, 2009·75 cites·18 claims
- 0496US6712621B2Thermally enhanced interposer and methodHIGH CONNECTION DENSITY INC·Filed 2002·Granted Mar 30, 2004·129 cites·21 claims
- 0593US11853357B2Method and system for dynamically analyzing, modifying, and distributing digital images and videoPANDOODLE CORP·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0693US7758351B2Method and system for batch manufacturing of spring elementsNEOCONIX INC·Filed 2007·Granted Jul 20, 2010·68 cites·26 claims
- 0792US6712620B1Coaxial elastomeric connector systemHIGH CONNECTION DENSITY INC·Filed 2002·Granted Mar 30, 2004·45 cites·34 claims
- 0892US6172895B1High capacity memory module with built-in-high-speed bus terminationsHIGH CONNECTION DENSITY INC·Filed 1999·Granted Jan 9, 2001·105 cites·25 claims
- 0991US9514381B1Method of identifying and replacing an object or area in a digital image with another object or areaPANDOODLE CORP·Filed 2014·Granted Dec 6, 2016·22 cites·24 claims
- 1091US8963926B2User customized animated video and method for making the sameBROWN DIRK D·Filed 2010·Granted Feb 24, 2015·449 cites·6 claims
- 1191US7070419B2Land grid array connector including heterogeneous contact elementsNEOCONIX INC·Filed 2004·Granted Jul 4, 2006·76 cites·12 claims
- 1291US6916181B2Remountable connector for land grid array packagesNEOCONIX INC·Filed 2003·Granted Jul 12, 2005·59 cites·30 claims
- 1390US11182618B2Method and system for dynamically analyzing, modifying, and distributing digital images and videoPANDOODLE CORP·Filed 2019·Granted Nov 23, 2021·5 cites·13 claims
- 1490US7244125B2Connector for making electrical contact at semiconductor scalesNEOCONIX INC·Filed 2003·Granted Jul 17, 2007·54 cites·35 claims
- 1590US6869290B2Circuitized connector for land grid arrayNEOCONIX INC·Filed 2004·Granted Mar 22, 2005·56 cites·13 claims
- 1690US6734559B1Self-aligned semiconductor interconnect barrier and manufacturing method thereforADVANCED MICRO DEVICES INC·Filed 2000·Granted May 11, 2004·59 cites·20 claims
- 1790US6239021B1Dual barrier and conductor deposition in a dual damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 29, 2001·52 cites·10 claims
- 1890US6124203AMethod for forming conformal barrier layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 26, 2000·107 cites·20 claims
- 1990US6022808ACopper interconnect methodology for enhanced electromigration resistanceADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 8, 2000·105 cites·20 claims
- 2087US6228754B1Method for forming semiconductor seed layers by inert gas sputter etchingADVANCED MICRO DEVICES INC·Filed 1999·Granted May 8, 2001·87 cites·22 claims
- 2186US11605227B2Method and system for dynamically analyzing, modifying, and distributing digital images and videoPANDOODLE CORP·Filed 2019·Granted Mar 14, 2023·4 cites·11 claims
- 2286US7113408B2Contact grid array formed on a printed circuit boardNEOCONIX INC·Filed 2003·Granted Sep 26, 2006·39 cites·6 claims
- 2384US9754166B2Method of identifying and replacing an object or area in a digital image with another object or areaPANDOODLE CORP·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 2482US12468762B2Method and system for dynamically analyzing, modifying, and distributing digital images and videoPANDOODLE CORP·Filed 2023·Granted Nov 11, 2025·0 cites·9 claims
- 2582US6103624AMethod of improving Cu damascene interconnect reliability by laser anneal before barrier polishADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 15, 2000·65 cites·17 claims
- 2681US6306732B1Method and apparatus for simultaneously improving the electromigration reliability and resistance of damascene vias using a controlled diffusivity barrierADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 23, 2001·66 cites·5 claims
- 2777US6117770AMethod for implanting semiconductor conductive layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 12, 2000·52 cites·20 claims
- 2875US6281121B1Damascene metal interconnects using highly directional deposition of barrier and/or seed layers including (III) filling metalADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 28, 2001·47 cites·38 claims
- 2974US6661690B2High capacity memory module with built-in performance enhancing featuresHIGH CONNECTION DENSITY INC·Filed 2002·Granted Dec 9, 2003·22 cites·34 claims
- 3074US6143650ASemiconductor interconnect interface processing by pulse laser annealADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 7, 2000·42 cites·12 claims
- 3173US6261946B1Method for forming semiconductor seed layers by high bias depositionADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 17, 2001·42 cites·19 claims
- 3273US6187670B1Multi-stage method for forming optimized semiconductor seed layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 13, 2001·45 cites·10 claims
- 3372US6121141AMethod of forming a void free copper interconnectsADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 19, 2000·39 cites·19 claims
- 3468US6147404ADual barrier and conductor deposition in a dual damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 14, 2000·29 cites·10 claims
- 3567US2015379552A1Virtual coupon delivery from coupon server to ACH to POS actuated by mobile phone scan of QR codeKENT CARL ERNEST·Filed 2014·Application pending·0 cites
- 3657US6066557AMethod for fabricating protected copper metallizationADVANCED MICRO DEVICES INC·Filed 1998·Granted May 23, 2000·21 cites·17 claims
- 3755US6080669ASemiconductor interconnect interface processing by high pressure depositionADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 27, 2000·19 cites·18 claims
- 3853US6146993AMethod for forming in-situ implanted semiconductor barrier layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 14, 2000·18 cites·18 claims
- 3951US12501993B2Towel clip and storage deviceBRAMAN MICHAEL·Filed 2023·Granted Dec 23, 2025·0 cites·7 claims
- 4047US6251772B1Dielectric adhesion enhancement in damascene process for semiconductorsADVANCED MICRO DEVICEES INC·Filed 1999·Granted Jun 26, 2001·15 cites·20 claims
- 4146US2010167561A1Structure and process for a contact grid array formed in a circuitized substrateNEOCONIX INC·Filed 2009·Application pending·0 cites
- 4241US2015229978A1User customized animated video and method for making the samePANDOODLE CORP·Filed 2015·Application pending·0 cites
- 4340US2005227510A1Small array contact with precision working rangeBROWN DIRK D·Filed 2004·Application pending·0 cites
- 4438US6059940AMethod for fabricating dual layer protective barrier copper metallizationADVANCED MICRO DEVICES INC·Filed 1998·Granted May 9, 2000·6 cites·16 claims
- 4537US2005120553A1Method for forming MEMS grid array connectorFiled 2003·Application pending·0 cites
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