Inventor · disambiguated record
Seiji Ohkura
Also filed as: OHKURA SEIJI
2 granted patents·38 citations·filing 1997–1999
64Inventor score
Technology areasH10P
Files withMITSUBISHI ELECTRIC CORP2
Top patents by PatentIndex Score
2 records- 0160US6319849B1Semiconductor device and a process for forming a protective insulating layer thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Nov 20, 2001·25 cites·19 claims
- 0246US5880518ASemiconductor device including a two-layer protective insulating layerMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 9, 1999·13 cites·14 claims
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