Inventor · disambiguated record
Nam-Seog Kim
Also filed as: KIM NAM-SEOG
66 granted patents·13 pending applications·1,848 citations·filing 1998–2020
99Inventor score
Top patents by PatentIndex Score
79 records- 0198US7598607B2Semiconductor packages with enhanced joint reliability and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 6, 2009·101 cites·14 claims
- 0298US6573746B2Impedance control circuitSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 3, 2003·130 cites·18 claims
- 0398US6187615B1Chip scale packages and methods for manufacturing the chip scale packages at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 13, 2001·364 cites·20 claims
- 0497US7807512B2Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 5, 2010·115 cites·20 claims
- 0597US6525558B2Programmable impedance control circuitSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 25, 2003·99 cites·10 claims
- 0695US7015590B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 21, 2006·119 cites·18 claims
- 0795US6661250B2Programmable impedance control circuitSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 9, 2003·74 cites·11 claims
- 0895US6642740B2Programmable termination circuit and methodSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 4, 2003·65 cites·10 claims
- 0994US8743582B23D semiconductor deviceKANG UK-SONG·Filed 2011·Granted Jun 3, 2014·19 cites·36 claims
- 1094US6376279B1method for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 23, 2002·81 cites·12 claims
- 1193US6429679B1Programmable impedance control circuit and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 6, 2002·50 cites·22 claims
- 1292US10122378B2Digital-to-time converter and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 6, 2018·10 cites·20 claims
- 1392US7271084B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 18, 2007·26 cites·42 claims
- 1492US6959856B2Solder bump structure and method for forming a solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 1, 2005·67 cites·14 claims
- 1589US9245827B23D semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·9 cites·21 claims
- 1689US6947336B2Semiconductor device with impedance control circuitSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 20, 2005·52 cites·20 claims
- 1788US7489570B2Semiconductor memory device with hierarchical bit line structureSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·15 cites·11 claims
- 1886US8373261B2Chip stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Feb 12, 2013·9 cites·15 claims
- 1986US6518508B2Ag-pre-plated lead frame for semiconductor packageSAMSUNG TECHWIN CO LTD·Filed 2001·Granted Feb 11, 2003·50 cites·11 claims
- 2085US8779576B2Wafer level package and methods of fabricating the samePARK SANG-WOOK·Filed 2011·Granted Jul 15, 2014·8 cites·27 claims
- 2185US8362621B2Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 29, 2013·14 cites·30 claims
- 2284US7825710B2Delay-locked loop circuits and method for generating transmission core clock signalsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 2, 2010·15 cites·20 claims
- 2384US7777345B2Semiconductor device having through electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·12 cites·12 claims
- 2483US7616512B2Semiconductor memory device with hierarchical bit line structureSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 10, 2009·10 cites·15 claims
- 2582US7170318B2Impedance controller and impedance control methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 30, 2007·10 cites·17 claims
- 2681US6555921B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 29, 2003·27 cites·12 claims
- 2779US8088648B2Method of manufacturing a chip stack packageJO CHA-JEA·Filed 2010·Granted Jan 3, 2012·6 cites·15 claims
- 2878US6577175B2Method for generating internal clock of semiconductor memory device and circuit thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 10, 2003·25 cites·12 claims
- 2975US10547315B2Frequency divider and a transceiver including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 28, 2020·2 cites·19 claims
- 3074US7830017B2Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 9, 2010·6 cites·13 claims
- 3174US7288966B2Programmable impedance controller and method for operatingSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 30, 2007·8 cites·10 claims
- 3274US7214604B2Method of fabricating ultra thin flip-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·17 cites·14 claims
- 3373US8114772B2Method of manufacturing the semiconductor deviceLEE KYU-HA·Filed 2010·Granted Feb 14, 2012·6 cites·20 claims
- 3473US6617894B2Circuits and methods for generating internal clock signal of intermediate phase relative to external clockSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 9, 2003·16 cites·22 claims
- 3573US6556038B2Impedance updating apparatus of termination circuit and impedance updating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 29, 2003·17 cites·14 claims
- 3672US6903451B1Chip scale packages manufactured at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 7, 2005·18 cites·32 claims
- 3771US7551013B2Phase interpolation circuit and method of generating phase interpolation signalSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 23, 2009·7 cites·16 claims
- 3871US6812578B2Semiconductor device bonding pad resistant to stress and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 2, 2004·18 cites·15 claims
- 3970US10326460B2Wide-range local oscillator (LO) generators and apparatuses including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 18, 2019·2 cites·19 claims
- 4070US8431479B2Semiconductor devices having redistribution structures and packages, and methods of forming the sameKIM KI-HYUK·Filed 2010·Granted Apr 30, 2013·4 cites·23 claims
- 4169US6583647B2Signal converting system having level converter for use in high speed semiconductor device and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 24, 2003·13 cites·12 claims
- 4268US8115324B2Semiconductor moduleKANG SUN-WON·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 4367US10747250B2Integrated circuit with adaptability to a process-voltage-temperature (PVT) variationSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 18, 2020·1 cites·20 claims
- 4467US6340838B1Apparatus and method for containing semiconductor chips to identify known good diesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 22, 2002·33 cites·13 claims
- 4566US6933758B2Synchronous mirror delay circuit with adjustable locking rangeSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 23, 2005·14 cites·16 claims
- 4664US11086345B2Integrated circuit with adaptability to a process-voltage-temperature (PVT) variationSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 10, 2021·0 cites·19 claims
- 4762US7638365B2Stacked chip package and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 29, 2009·2 cites·29 claims
- 4862US7016257B2Semiconductor memory device capable of generating variable clock signals according to modes of operationSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 21, 2006·12 cites·19 claims
- 4962US6930508B2Integrated circuit with on-chip terminationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 16, 2005·7 cites·17 claims
- 5059US6834366B2Method of outputting internal information through test pin of semiconductor memory and output circuit thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 21, 2004·10 cites·16 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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