Inventor · disambiguated record

Jiro Oseto

Also filed as: OSETO JIRO

1 granted patent·224 citations·filing 1995–1995

57Inventor score

Technology areasH10W

Files withMITSUBISHI ELECTRIC CORP1

Top patents by PatentIndex Score

1 record

0191US5766972AMethod of making resin encapsulated semiconductor device with bump electrodesMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 16, 1998·224 cites·7 claims

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