Inventor · disambiguated record
Dongsoo Moo
Also filed as: MOO DONGSOO
2 granted patents·30 citations·filing 2011–2012
63Inventor score
Technology areasH10W
Files withKIM OHHAN2
Top patents by PatentIndex Score
2 records- 0191US8273604B2Semiconductor device and method of forming WLCSP structure using protruded MLPKIM OHHAN·Filed 2011·Granted Sep 25, 2012·17 cites·22 claims
- 0290US8519544B2Semiconductor device and method of forming WLCSP structure using protruded MLPKIM OHHAN·Filed 2012·Granted Aug 27, 2013·13 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →