Inventor · disambiguated record
Robert A. Huertas
Also filed as: HUERTAS ROBERT · HUERTAS ROBERT A
32 granted patents·4 pending applications·687 citations·filing 1997–2013
98Inventor score
Files withADVANCED MICRO DEVICES INC26INTERMOLECULAR INC3SPANSION LLC2ADVANCED MICRO DEVICES INC AND SPANSION LLC1ADVANCED MICRO DEVICES INS1
Top patents by PatentIndex Score
36 records- 0195US9018037B1Vertical oxide-oxide interface for forming-free, low power and low variability RRAM devicesINTERMOLECULAR INC·Filed 2013·Granted Apr 28, 2015·14 cites·12 claims
- 0293US6528432B1H2-or H2/N2-plasma treatment to prevent organic ILD degradationADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 4, 2003·68 cites·34 claims
- 0392US6562416B2Method of forming low resistance viasADVANCED MICRO DEVICES INC·Filed 2001·Granted May 13, 2003·57 cites·12 claims
- 0486US7534732B1Semiconductor devices with copper interconnects and composite silicon nitride capping layersSPANSION LLC·Filed 2006·Granted May 19, 2009·12 cites·7 claims
- 0586US6143672AMethod of reducing metal voidings in 0.25 μm AL interconnectADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 7, 2000·65 cites·17 claims
- 0684US8415256B1Gap-filling with uniform propertiesNICKEL ALEXANDER·Filed 2010·Granted Apr 9, 2013·9 cites·14 claims
- 0784US6774432B1UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOLADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 10, 2004·31 cites·20 claims
- 0884US6482755B1HDP deposition hillock suppression method in integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 19, 2002·29 cites·18 claims
- 0984US6033922AMonitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test waferADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 7, 2000·82 cites·3 claims
- 1083US6383925B1Method of improving adhesion of capping layers to cooper interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·35 cites·10 claims
- 1182US6818557B1Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 16, 2004·28 cites·20 claims
- 1281US6348410B1Low temperature hillock suppression method in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 19, 2002·24 cites·12 claims
- 1380US6521529B1HDP treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 18, 2003·27 cites·19 claims
- 1480US5970313AMonitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test waferADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 19, 1999·63 cites·15 claims
- 1578US6875694B1Method of treating inlaid copper for improved capping layer adhesion without damaging porous low-k materialsADVANCED MICRO DEVICES INC·Filed 2004·Granted Apr 5, 2005·24 cites·20 claims
- 1677US7884030B1Gap-filling with uniform propertiesADVANCED MICRO DEVICES INC AND SPANSION LLC·Filed 2006·Granted Feb 8, 2011·7 cites·14 claims
- 1775US6383880B1NH3/N2-plasma treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·20 cites·17 claims
- 1871US7300886B1Interlayer dielectric for charge loss improvementSPANSION LLC·Filed 2005·Granted Nov 27, 2007·3 cites·20 claims
- 1970US6596631B1Method of forming copper interconnect capping layers with improved interface and adhesionADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 22, 2003·17 cites·19 claims
- 2069US6235654B1Process for forming PECVD nitride with a very low deposition rateADVANCED MICRO DEVICES INC·Filed 2000·Granted May 22, 2001·12 cites·12 claims
- 2165US6809043B1Multi-stage, low deposition rate PECVD oxideADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 26, 2004·9 cites·17 claims
- 2263US7018896B2UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processingADVANCED MICRO DEVICES INC·Filed 2004·Granted Mar 28, 2006·9 cites·20 claims
- 2363US6686232B1Ultra low deposition rate PECVD silicon nitrideADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 3, 2004·8 cites·19 claims
- 2462US6661067B1Nitrogen-plasma treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 9, 2003·6 cites·5 claims
- 2561US8026169B2Cu annealing for improved data retention in flash memory devicesADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 27, 2011·2 cites·6 claims
- 2661US6465349B1Nitrogen-plasma treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INS·Filed 2000·Granted Oct 15, 2002·8 cites·15 claims
- 2761US6221793B1Process for forming PECVD undoped oxide with a super low deposition rate on a single state depositionADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 24, 2001·7 cites·19 claims
- 2860US6489253B1Method of forming a void-free interlayer dielectric (ILD0) for 0.18-μm flash memory technology and semiconductor device thereby formedADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 3, 2002·6 cites·10 claims
- 2950US7023046B2Undoped oxide liner/BPSG for improved data retentionADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 4, 2006·3 cites·3 claims
- 3046US6388330B1Low dielectric constant etch stop layers in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted May 14, 2002·2 cites·10 claims
- 3143US8791445B2Interfacial oxide used as switching layer in a nonvolatile resistive memory elementHIGUCHI RANDALL·Filed 2012·Granted Jul 29, 2014·0 cites·20 claims
- 3243US2015170923A1Feature Size Reduction in Semiconductor Devices by Selective Wet EtchingINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 3342US2008096364A1Conformal liner for gap-fillingADVANCED MICRO DEVICES INC·Filed 2006·Application pending·0 cites
- 3441US6627973B1Void-free interlayer dielectric (ILD0) for 0.18-micron flash memory semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 30, 2003·0 cites·15 claims
- 3541US2014154859A1Methods and Vehicles for High Productivity Combinatorial Testing of Materials for Resistive Random Access Memory CellsINTERMOLECULAR INC·Filed 2012·Application pending·0 cites
- 3640US2006046502A1Deposition of hard-mask with minimized hillocks and bubblesNGO MINH V·Filed 2004·Application pending·0 cites
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