Inventor · disambiguated record
Josh D. Woodland
Also filed as: WOODLAND JOSH · WOODLAND JOSH D
3 granted patents·1 pending application·15 citations·filing 2010–2013
62Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0184US9362143B2Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packagesSUN YANGYANG·Filed 2012·Granted Jun 7, 2016·12 cites·26 claims
- 0267US8492242B2Dry flux bonding device and methodFAY OWEN·Filed 2010·Granted Jul 23, 2013·3 cites·22 claims
- 0349US2013299868A1Dry flux bonding device and methodMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 0441US9123700B2Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate viasGANDHI JASPREET S·Filed 2012·Granted Sep 1, 2015·0 cites·24 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →