Inventor · disambiguated record
James J. Kelly
Also filed as: KELLY JAMES · KELLY JAMES J · KELLY JAMES JOHN · KELLY JR JAMES J
59 granted patents·9 pending applications·358 citations·filing 1977–2025
98Inventor score
Top patents by PatentIndex Score
68 records- 0198US10395986B1Fully aligned via employing selective metal depositionIBM·Filed 2018·Granted Aug 27, 2019·24 cites·19 claims
- 0297US10529622B1Void-free metallic interconnect structures with self-formed diffusion barrier layersIBM·Filed 2018·Granted Jan 7, 2020·16 cites·20 claims
- 0395US9780035B1Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnectsIBM·Filed 2016·Granted Oct 3, 2017·10 cites·25 claims
- 0495US8435887B2Copper interconnect formationKELLY JAMES J·Filed 2011·Granted May 7, 2013·33 cites·14 claims
- 0594US10361119B1Enlarged contact area structure using noble metal cap and noble metal linerIBM·Filed 2018·Granted Jul 23, 2019·10 cites·20 claims
- 0691US10276434B1Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integrationIBM·Filed 2018·Granted Apr 30, 2019·6 cites·20 claims
- 0789US10943883B1Planar wafer level fan-out of multi-chip modules having different size chipsIBM·Filed 2019·Granted Mar 9, 2021·6 cites·20 claims
- 0888US8853095B1Hybrid hard mask for damascene and dual damasceneIBM·Filed 2013·Granted Oct 7, 2014·8 cites·21 claims
- 0985US10910307B2Back end of line metallization structureIBM·Filed 2018·Granted Feb 2, 2021·3 cites·16 claims
- 1085US10903161B2Back end of line metallization structureIBM·Filed 2019·Granted Jan 26, 2021·3 cites·20 claims
- 1185US9466563B2Interconnect structure for an integrated circuit and method of fabricating an interconnect structureST MICROELECTRONICS INC·Filed 2014·Granted Oct 11, 2016·7 cites·18 claims
- 1283US10665512B2Stress modulation of nFET and pFET fin structuresIBM·Filed 2018·Granted May 26, 2020·3 cites·14 claims
- 1383US8691687B2Superfilled metal contact vias for semiconductor devicesKELLY JAMES J·Filed 2010·Granted Apr 8, 2014·8 cites·20 claims
- 1482US11152298B2Metal via structureIBM·Filed 2019·Granted Oct 19, 2021·3 cites·18 claims
- 1582US4123949AInertial energy storage deviceUS ENERGY·Filed 1977·Granted Nov 7, 1978·42 cites·6 claims
- 1681US11049844B2Semiconductor wafer having trenches with varied dimensions for multi-chip modulesIBM·Filed 2019·Granted Jun 29, 2021·3 cites·4 claims
- 1780US10832973B2Stress modulation of nFET and pFET fin structuresIBM·Filed 2020·Granted Nov 10, 2020·1 cites·20 claims
- 1880US8698318B2Superfilled metal contact vias for semiconductor devicesIBM·Filed 2013·Granted Apr 15, 2014·4 cites·19 claims
- 1980US5100464ASteel mill by-product material briquettes and pelletsWOMCO INC·Filed 1990·Granted Mar 31, 1992·37 cites·11 claims
- 2079US10615027B1Stack viabar structuresIBM·Filed 2018·Granted Apr 7, 2020·2 cites·20 claims
- 2178US11133457B2Controllable formation of recessed bottom electrode contact in a memory metallization stackIBM·Filed 2019·Granted Sep 28, 2021·1 cites·11 claims
- 2277US9793213B2Ion flow barrier structure for interconnect metallizationIBM·Filed 2016·Granted Oct 17, 2017·2 cites·7 claims
- 2377US2025354597A1Impact absorbing apparatusKELLY JAMES·Filed 2025·Application pending·0 cites
- 2476US10825726B2Metal spacer self aligned multi-patterning integrationIBM·Filed 2018·Granted Nov 3, 2020·2 cites·7 claims
- 2576US7501345B1Selective silicide formation by electrodeposit displacement reactionIBM·Filed 2008·Granted Mar 10, 2009·5 cites·4 claims
- 2676US4740088ASafety and sanitary system improvements for frozen confections blending machinesKELLY JR JAMES J·Filed 1986·Granted Apr 26, 1988·58 cites·9 claims
- 2775US10128151B2Devices and methods of cobalt fill metallizationGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 13, 2018·2 cites·17 claims
- 2874US9716065B2Via bottom structure and methods of formingIBM·Filed 2015·Granted Jul 25, 2017·2 cites·17 claims
- 2973US11315831B2Dual redistribution layer structureIBM·Filed 2019·Granted Apr 26, 2022·1 cites·5 claims
- 3071US12438046B2Dual redistribution layer structureIBM·Filed 2022·Granted Oct 7, 2025·0 cites·19 claims
- 3171US12297884B2Impact absorbing apparatusKELLY JAMES·Filed 2022·Granted May 13, 2025·0 cites·19 claims
- 3271US9184042B1Wafer backside particle mitigationIBM·Filed 2014·Granted Nov 10, 2015·2 cites·17 claims
- 3371US6802950B2Apparatus and method for controlling plating uniformitySANDIA NAT LAB·Filed 2002·Granted Oct 12, 2004·7 cites·23 claims
- 3469US6902827B2Process for the electrodeposition of low stress nickel-manganese alloysSANDIA NAT LAB·Filed 2002·Granted Jun 7, 2005·28 cites·21 claims
- 3567US10520056B2Impact absorbing apparatusKLNP LLC·Filed 2017·Granted Dec 31, 2019·1 cites·20 claims
- 3666US11251126B2Replacement metal cap by an exchange reactionIBM·Filed 2020·Granted Feb 15, 2022·0 cites·11 claims
- 3764US11848273B2Bridge chip with through viaIBM·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 3864US2020132157A1Impact absorbing apparatusKELLY JAMES·Filed 2019·Application pending·0 cites
- 3963US11784120B2Metal via structureIBM·Filed 2021·Granted Oct 10, 2023·0 cites·19 claims
- 4063US10971356B2Stack viabar structuresIBM·Filed 2020·Granted Apr 6, 2021·0 cites·20 claims
- 4162US12469787B2Resist patterned redistribution wiring on copper polyimide via layerIBM·Filed 2022·Granted Nov 11, 2025·0 cites·19 claims
- 4262US2025343169A1Encapsulating a portion of a through-silicon-viaIBM·Filed 2024·Application pending·0 cites
- 4362US2025343108A1Through-silicon-via annular guard ringIBM·Filed 2024·Application pending·0 cites
- 4461US11682640B2Protective surface layer on under bump metallurgy for solder joiningIBM·Filed 2020·Granted Jun 20, 2023·0 cites·8 claims
- 4560US11948442B2Device and system for ultrasonic transmission of accelerometer dataKELLY JAMES·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 4658US10714389B2Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integrationELPIS TECH INC·Filed 2019·Granted Jul 14, 2020·0 cites·20 claims
- 4758US10134674B2Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnectsIBM·Filed 2017·Granted Nov 20, 2018·0 cites·20 claims
- 4858US2025046654A1Differential etch rates of copper featuresIBM·Filed 2023·Application pending·0 cites
- 4958US2024431025A1Corrosion resistant single damascene interconnectsIBM·Filed 2023·Application pending·0 cites
- 5057US11171006B2Simultaneous plating of varying size features on semiconductor substrateIBM·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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