Inventor · disambiguated record

Mai-Anh T Bui

Also filed as: BUI MAI-ANH T

1 granted patent·1 pending application·0 citations·filing 2015–2018

6Inventor score

Technology areasB29C B33Y

Files withSIEMENS IND SOFTWARE INC1 SIEMENS PRODUCT LIFECYCLE MAN SOFTWARE INC1

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2 records

0143US11292201B2Additive swept wedge buildup toolpathSIEMENS IND SOFTWARE INC·Filed 2018·Granted Apr 5, 2022·0 cites·14 claims
0229US2016263832A1Apparatus and method for additive manufacturingSIEMENS PRODUCT LIFECYCLE MAN SOFTWARE INC·Filed 2015·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →