Inventor · disambiguated record

Tatsuya Wagoh

Also filed as: WAGOH TATSUYA

1 granted patent·8 citations·filing 2006–2006

30Inventor score

Technology areasH10W

Files withTDK CORP1

Top patents by PatentIndex Score

1 record

0173US7591406B2Soldering method, soldering device, bonding method, bonding device, and nozzle unitTDK CORP·Filed 2006·Granted Sep 22, 2009·8 cites·1 claims

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Tatsuya Wagoh — Patent Inventor | PatentIndex