Inventor · disambiguated record
Kevin Lally
Also filed as: LALLY KEVIN · LALLY KEVIN J
10 granted patents·1 pending application·178 citations·filing 2004–2008
89Inventor score
Top patents by PatentIndex Score
11 records- 0196US7477960B2Fault detection and classification (FDC) using a run-to-run controllerTOKYO ELECTRON LTD·Filed 2005·Granted Jan 13, 2009·86 cites·51 claims
- 0295US7324193B2Measuring a damaged structure formed on a wafer using optical metrologyTOKYO ELECTRON LTD·Filed 2006·Granted Jan 29, 2008·30 cites·20 claims
- 0391US7642102B2Real-time parameter tuning using wafer thicknessTOKYO ELECTRON LTD·Filed 2007·Granted Jan 5, 2010·15 cites·39 claims
- 0489US7801635B2Real-time parameter tuning for etch processesTOKYO ELECTRON LTD·Filed 2007·Granted Sep 21, 2010·13 cites·28 claims
- 0585US7619731B2Measuring a damaged structure formed on a wafer using optical metrologyTOKYO ELECTRON LTD·Filed 2006·Granted Nov 17, 2009·11 cites·18 claims
- 0680US7623978B2Damage assessment of a wafer using optical metrologyTOKYO ELECTRON LTD·Filed 2006·Granted Nov 24, 2009·7 cites·45 claims
- 0776US7576851B2Creating a library for measuring a damaged structure formed on a wafer using optical metrologyTOKYO ELECTRON LTD·Filed 2006·Granted Aug 18, 2009·5 cites·8 claims
- 0872US7571074B2Method of using a wafer-thickness-dependant profile libraryTOKYO ELECTRON LTD·Filed 2007·Granted Aug 4, 2009·3 cites·32 claims
- 0965US7289864B2Feature dimension deviation correction system, method and program productTOKYO ELECTRON LTD·Filed 2004·Granted Oct 30, 2007·8 cites·30 claims
- 1053US7502660B2Feature dimension deviation correction system, method and program productIBM·Filed 2007·Granted Mar 10, 2009·0 cites·27 claims
- 1153US2008137078A1Measuring a damaged structure formed on a wafer using optical metrologyTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
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