Inventor · disambiguated record
Scott D. Marshall
Also filed as: MARSHALL SCOTT D · MARSHALL SCOTT DUNCAN
10 granted patents·36 citations·filing 2003–2022
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0195US11621673B2Power amplifier packages and systems incorporating design-flexible package platformsNXP USA INC·Filed 2020·Granted Apr 4, 2023·4 cites·23 claims
- 0294US11342275B2Leadless power amplifier packages including topside terminations and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted May 24, 2022·4 cites·10 claims
- 0390US11984429B2Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereofNXP USA INC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0490US9673162B2High power semiconductor package subsystemsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Jun 6, 2017·11 cites·10 claims
- 0581US9281283B2Semiconductor devices with impedance matching-circuitsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Mar 8, 2016·5 cites·16 claims
- 0675US9748185B2Semiconductor devices with impedance matching-circuitsFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 29, 2017·2 cites·16 claims
- 0769US10211177B2High power semiconductor package subsystemsNXP USA INC·Filed 2017·Granted Feb 19, 2019·1 cites·10 claims
- 0864US11621231B2Methods of fabricating leadless power amplifier packages including topside terminationsNXP USA INC·Filed 2022·Granted Apr 4, 2023·0 cites·19 claims
- 0954US6982483B2High impedance radio frequency power plastic packageFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 3, 2006·7 cites·23 claims
- 1041US11049837B2Bond wire array for packaged semiconductor deviceNXP USA INC·Filed 2019·Granted Jun 29, 2021·0 cites·17 claims
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