Inventor · disambiguated record
Ryoji Nishio
Also filed as: NISHIO RYOJI
42 granted patents·33 pending applications·751 citations·filing 1996–2019
98Inventor score
Top patents by PatentIndex Score
75 records- 0195US6646233B2Wafer stage for wafer processing apparatus and wafer processing methodHITACHI HIGH TECH CORP·Filed 2002·Granted Nov 11, 2003·89 cites·2 claims
- 0294US6833051B2Plasma processing apparatus and methodHITACHI LTD·Filed 2002·Granted Dec 21, 2004·33 cites·13 claims
- 0394US6590179B2Plasma processing apparatus and methodHITACHI LTD·Filed 2001·Granted Jul 8, 2003·66 cites·29 claims
- 0493US7138606B2Wafer processing methodHITACHI HIGH TECH CORP·Filed 2003·Granted Nov 21, 2006·53 cites·12 claims
- 0592US6180019B1Plasma processing apparatus and methodHITACHI LTD·Filed 1997·Granted Jan 30, 2001·51 cites·2 claims
- 0691US6499424B2Plasma processing apparatus and methodHITACHI LTD·Filed 2001·Granted Dec 31, 2002·23 cites·12 claims
- 0791US6245202B1Plasma treatment deviceHITACHI LTD·Filed 1996·Granted Jun 12, 2001·115 cites·16 claims
- 0890US8906196B2Plasma processing apparatus and method for controlling the sameNISHIO RYOJI·Filed 2008·Granted Dec 9, 2014·11 cites·3 claims
- 0990US6895179B2Wafer stage for wafer processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted May 17, 2005·37 cites·5 claims
- 1089US8632637B2Method and apparatus for plasma processingHITACHI HIGH TECH CORP·Filed 2012·Granted Jan 21, 2014·6 cites·2 claims
- 1189US6825617B2Semiconductor processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted Nov 30, 2004·37 cites·11 claims
- 1286US8329054B2Plasma processing apparatus and plasma processing methodICHINO TAKAMASA·Filed 2008·Granted Dec 11, 2012·14 cites·2 claims
- 1386US7833429B2Plasma processing methodHITACHI HIGH TECH CORP·Filed 2007·Granted Nov 16, 2010·7 cites·4 claims
- 1486US6759253B2Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring unitsHITACHI LTD·Filed 2001·Granted Jul 6, 2004·27 cites·33 claims
- 1583US6716301B2Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probeHITACHI LTD·Filed 2001·Granted Apr 6, 2004·25 cites·23 claims
- 1682US8083889B2Apparatus and method for plasma etchingMIYA GO·Filed 2009·Granted Dec 27, 2011·6 cites·2 claims
- 1782US6846363B2Plasma processing apparatus and methodHITACHI LTD·Filed 2002·Granted Jan 25, 2005·11 cites·6 claims
- 1881US6481370B2Plasma processsing apparatusHITACHI LTD·Filed 2000·Granted Nov 19, 2002·10 cites·9 claims
- 1979US8062473B2Plasma processing apparatus and methodNISHIO RYOJI·Filed 2008·Granted Nov 22, 2011·4 cites·3 claims
- 2079US6172321B1Method and apparatus for plasma processing apparatusHITACHI LTD·Filed 1999·Granted Jan 9, 2001·26 cites·4 claims
- 2177US6034346AMethod and apparatus for plasma processing apparatusHITACHI LTD·Filed 1996·Granted Mar 7, 2000·27 cites·11 claims
- 2276US6771481B2Plasma processing apparatus for processing semiconductor wafer using plasmaHITACHI LTD·Filed 2001·Granted Aug 3, 2004·19 cites·21 claims
- 2372US9039865B2Plasma processing apparatusYOSHIOKA KEN·Filed 2010·Granted May 26, 2015·3 cites·7 claims
- 2471US10262835B2Plasma processing equipment and plasma generation equipmentHITACHI HIGH TECH CORP·Filed 2016·Granted Apr 16, 2019·1 cites·12 claims
- 2570US9566821B2Plasma processing apparatus and plasma processing methodHITACHI HIGH TECH CORP·Filed 2012·Granted Feb 14, 2017·2 cites·6 claims
- 2670US8186300B2Plasma processing apparatusICHINO TAKAMASA·Filed 2009·Granted May 29, 2012·4 cites·5 claims
- 2770US7713756B2Apparatus and method for plasma etchingHITACHI HIGH TECH CORP·Filed 2007·Granted May 11, 2010·2 cites·2 claims
- 2868US8940128B2Plasma processing apparatusSAKKA YUSAKU·Filed 2010·Granted Jan 27, 2015·4 cites·3 claims
- 2968US8057634B2Method and apparatus for plasma processingNISHIO RYOJI·Filed 2004·Granted Nov 15, 2011·7 cites·6 claims
- 3066US6747239B2Plasma processing apparatus and methodHITACHI LTD·Filed 2003·Granted Jun 8, 2004·8 cites·15 claims
- 3163US7740739B2Plasma processing apparatus and methodHITACHI HIGH TECH CORP·Filed 2004·Granted Jun 22, 2010·5 cites·9 claims
- 3263US6967109B2Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring unitsHITACHI LTD·Filed 2004·Granted Nov 22, 2005·6 cites·6 claims
- 3362US10998168B2Plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2019·Granted May 4, 2021·0 cites·4 claims
- 3462US9805915B2Plasma processing apparatusGUSHIKEN MASAHARU·Filed 2011·Granted Oct 31, 2017·4 cites·14 claims
- 3560US8795467B2Plasma processing apparatus and methodNISHIO RYOJI·Filed 2009·Granted Aug 5, 2014·0 cites·4 claims
- 3659US8425786B2Plasma etching method and plasma etching apparatusSATAKE MAKOTO·Filed 2010·Granted Apr 23, 2013·1 cites·9 claims
- 3759US7892444B2Plasma processing apparatus and method for controlling the sameHITACHI HIGH TECH CORP·Filed 2007·Granted Feb 22, 2011·0 cites·1 claims
- 3859US2014137059A1Method and apparatus for plasma processingHITACHI HIGH TECH CORP·Filed 2014·Application pending·0 cites
- 3957US6835665B2Etching method of hardly-etched material and semiconductor fabricating method and apparatus using the methodHITACHI HIGH TECH CORP·Filed 2002·Granted Dec 28, 2004·5 cites·21 claims
- 4057US2009095423A1Apparatus and method for plasma etchingMIYA GO·Filed 2008·Application pending·0 cites
- 4155US2007227669A1Method and apparatus for plasma processingNISHIO RYOJI·Filed 2007·Application pending·0 cites
- 4255US2007232085A1Method and apparatus for plasma processingNISHIO RYOJI·Filed 2007·Application pending·0 cites
- 4355US2008011425A1Plasma Processing Apparatus And MethodNISHIO RYOJI·Filed 2007·Application pending·0 cites
- 4454US8366870B2Method and apparatus for plasma processingHITACHI HIGH TECH CORP·Filed 2011·Granted Feb 5, 2013·0 cites·1 claims
- 4554US2011284167A1Plasma processing equipment and plasma generation equipmentNISHIO RYOJI·Filed 2009·Application pending·0 cites
- 4653US2006113037A1Plasma processing apparatus and method for controlling the sameNISHIO RYOJI·Filed 2005·Application pending·0 cites
- 4751US7183715B2Method for operating a semiconductor processing apparatusHITACHI HIGH TECH CORP·Filed 2004·Granted Feb 27, 2007·2 cites·18 claims
- 4851US2009283502A1Plasma processing apparatus and control method for plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2008·Application pending·0 cites
- 4951US2008236751A1Plasma Processing ApparatusARAMAKI TOORU·Filed 2007·Application pending·0 cites
- 5050US2010175833A1Plasma processing apparatus and plasma generating apparatusHITACHI HIGH TECH CORP·Filed 2009·Application pending·0 cites
Showing the top 50 of 75 patent records by PatentIndex Score.
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