Inventor · disambiguated record
Hong Liu
Also filed as: LIU HONG · Liu hong-tao
14 granted patents·4 pending applications·31 citations·filing 2009–2024
87Inventor score
Files withHONGFUJIN PREC ELECT ZHENGZHOU CO LTD4HON HAI PREC IND CO LTD3FIH HONG KONG LTD2FUTUREWEI TECHNOLOGIES INC2SEMICONDUCTOR MFG INT BEIJING CORP2
Top patents by PatentIndex Score
18 records- 0186US11062782B2Three-dimensional memory device programming with reduced disturbanceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 13, 2021·2 cites·20 claims
- 0283US12223704B2Label-free cell classification and screening system based on hybrid transfer learningUNIV SHANDONG·Filed 2022·Granted Feb 11, 2025·2 cites·8 claims
- 0378US7841900B2High speed electrical connector having improved housing for harboring preloaded contactHON HAI PREC IND CO LTD·Filed 2009·Granted Nov 30, 2010·17 cites·12 claims
- 0476US2023298831A1Waterproof partitionHONGFUJIN PREC ELECT ZHENGZHOU CO LTD·Filed 2023·Application pending·0 cites
- 0570US10892023B2Three-dimensional memory device programming with reduced disturbanceYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jan 12, 2021·2 cites·10 claims
- 0670US7955130B2Electrical connector with shielding plates without mounting tail and grounding memberHON HAI PREC IND CO LTD·Filed 2010·Granted Jun 7, 2011·7 cites·20 claims
- 0768US11233025B2Merged power pad for improving integrated circuit power deliveryFUTUREWEI TECHNOLOGIES INC·Filed 2018·Granted Jan 25, 2022·1 cites·13 claims
- 0867US11688704B2Merged power pad for improving integrated circuit power deliveryFUTUREWEI TECHNOLOGIES INC·Filed 2022·Granted Jun 27, 2023·0 cites·20 claims
- 0965US12121859B1Modular membrane isolation carbon desorption device, carbon capture system, method and applicationUNIV CENTRAL SOUTH·Filed 2024·Granted Oct 22, 2024·0 cites·21 claims
- 1065US11682532B2Electronic device, waterproof button structure, and waterproof partitionHONGFUJIN PREC ELECT ZHENGZHOU CO LTD·Filed 2019·Granted Jun 20, 2023·0 cites·13 claims
- 1162US12473705B2Sel-reporting monitor for integrity and conditions of manhole coverZHENGZHOU WANMAYUN ELECTRONIC TECH CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 1259US11417609B2Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 1353US12091888B2Anti-counterfeiting assembly and packing box having the sameHONGFUJIN PREC ELECT ZHENGZHOU CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·18 claims
- 1452US12060206B2Anti-counterfeiting structure and packaging box having the sameHONGFUJIN PREC ELECT ZHENGZHOU CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·18 claims
- 1550US10854558B2Semiconductor structure and fabrication method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 1648US2014369788A1Rivet structure for connecting structureFIH HONG KONG LTD·Filed 2013·Application pending·0 cites
- 1748US2015023754A1Nut structure for connecting structureFIH HONG KONG LTD·Filed 2013·Application pending·0 cites
- 1840US2010093209A1Electrical connector assembly with improved resisting structure to ensure reliable contacting between ground shields thereofHON HAI PREC IND CO LTD·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →