Inventor · disambiguated record
Wen-Yen Lin
Also filed as: LIN WEN HSIUNG · LIN WEN-CHI · LIN WEN-YEN
18 granted patents·10 pending applications·192 citations·filing 1998–2022
93Inventor score
Files withUNIV CHANG GUNG6COMPEQ MFG CO LTD4FOSITEK CORP3QUANTA COMP INC3COMPEQ MANUFACTURING COMPANY L1
Top patents by PatentIndex Score
28 records- 0192US11812570B1FPC/FFC tension keeping device and electronic deviceFOSITEK CORP·Filed 2022·Granted Nov 7, 2023·2 cites·14 claims
- 0288US6784831B1Method and apparatus for GPS signal receiving that employs a frequency-division-multiplexed phased array communication mechanismTIA MOBILE INC·Filed 2003·Granted Aug 31, 2004·89 cites·35 claims
- 0383US12006749B2Displaceable rotating shaft structure and foldable device having the sameFOSITEK CORP·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 0479US6278356B1Flat, built-in resistors and capacitors for a printed circuit boardCOMPEQ MFG CO LTD·Filed 2000·Granted Aug 21, 2001·29 cites·5 claims
- 0569US7130191B2Function module with built-in heat dissipation deviceQUANTA COMP INC·Filed 2004·Granted Oct 31, 2006·21 cites·30 claims
- 0668US11304626B2Feature point identification method of mechanocardiographyUNIV CHANG GUNG·Filed 2020·Granted Apr 19, 2022·0 cites·3 claims
- 0768US9833172B2Feature point identification method of mechanocardiographyUNIV CHANG GUNG·Filed 2016·Granted Dec 5, 2017·1 cites·3 claims
- 0865US7123876B2Easy set-up, vehicle mounted, in-motion tracking, satellite antennaMOTIA·Filed 2001·Granted Oct 17, 2006·20 cites·13 claims
- 0962US10799151B2Feature point identification method of mechanocardiographyUNIV CHANG GUNG·Filed 2019·Granted Oct 13, 2020·0 cites·3 claims
- 1061US11013429B2Feature point identification method of mechanocardiographyUNIV CHANG GUNG·Filed 2018·Granted May 25, 2021·0 cites·2 claims
- 1158US10238319B2Feature point identification method of mechanocardiographyUNIV CHANG GUNG·Filed 2017·Granted Mar 26, 2019·0 cites·3 claims
- 1258US6988048B2Portable computer and system controlling method thereofQUANTA COMP INC·Filed 2004·Granted Jan 17, 2006·8 cites·20 claims
- 1354US6753746B2Printed circuit board having jumper lines and the method for making said printed circuit boardCOMPEQ MFG CO LTD·Filed 2001·Granted Jun 22, 2004·6 cites·2 claims
- 1453US12010808B2FPC/FFC tension keeping device and electronic apparatus having the sameFOSITEK CORP·Filed 2022·Granted Jun 11, 2024·0 cites·10 claims
- 1549US10820945B2System for facilitating medical treatmentUNIV CHANG GUNG·Filed 2018·Granted Nov 3, 2020·0 cites·12 claims
- 1647US2006176678A1Front side bus moduleQUANTA COMP INC·Filed 2006·Application pending·0 cites
- 1746US2003093697A1Method for preventing unauthorized persons from entering and using a computer facilityFiled 2001·Application pending·0 cites
- 1844US6295631B1Method for determining the compensation value of the width of a wire by measuring the resistance of the wireCOMPEQ MFG CO LTD·Filed 1999·Granted Sep 25, 2001·10 cites·4 claims
- 1944US2004205281A1Front side bus moduleFiled 2004·Application pending·0 cites
- 2040US11151701B2Image grid line removing method and system thereofUNIV NAT CHUNG CHENG·Filed 2019·Granted Oct 19, 2021·0 cites·6 claims
- 2139US2004214466A1Joint connector of printed circuit board and manufacturing method thereofFiled 2004·Application pending·0 cites
- 2238US2004218361A1Function module with built-in plate-type heat dissipation deviceFiled 2004·Application pending·0 cites
- 2337US2004217466A1Function module and its manufacturing methodFiled 2004·Application pending·0 cites
- 2437US2002002771A1Method for making a planar inductor/transformer in a laminated printed circuit boardCOMPEQ MFG CO LTD·Filed 2001·Application pending·0 cites
- 2537US2003080826A1Method of shortening a microwave circuit and the printed circuit board made by using said methodFiled 2001·Application pending·0 cites
- 2634US2004218367A1Function module with built-in heat dissipation finFiled 2004·Application pending·0 cites
- 2734US2003076641A1Circuit board having interference preventing deviceFiled 2001·Application pending·0 cites
- 2832US6057179AMethod and structure for packaging an integrated circuit with readily removed excess encapsulant on degating regionCOMPEQ MANUFACTURING COMPANY L·Filed 1998·Granted May 2, 2000·4 cites·28 claims
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