Inventor · disambiguated record
Cindy Kuo
Also filed as: KUO CINDY
2 granted patents·6 citations·filing 2012–2015
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0180US9177914B2Metal pad structure over TSV to reduce shorting of upper metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 3, 2015·5 cites·20 claims
- 0263US9530690B2Metal pad structure over TSV to reduce shorting of upper metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·1 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →