Inventor · disambiguated record
Mark Wilcoxson
Also filed as: WILCOXSON MARK · WILCOXSON MARK H · WILCOXSON MARK HENRY
34 granted patents·13 pending applications·505 citations·filing 1999–2018
97Inventor score
Top patents by PatentIndex Score
47 records- 0197US9620377B2Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etchLAM RES CORP·Filed 2015·Granted Apr 11, 2017·25 cites·21 claims
- 0296US10170323B2Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etchLAM RES CORP·Filed 2017·Granted Jan 1, 2019·11 cites·17 claims
- 0396US9543148B1Mask shrink layer for high aspect ratio dielectric etchLAM RES CORP·Filed 2015·Granted Jan 10, 2017·56 cites·19 claims
- 0496US6341574B1Plasma processing systemsLAM RES CORP·Filed 1999·Granted Jan 29, 2002·135 cites·2 claims
- 0595US9673058B1Method for etching features in dielectric layersLAM RES CORP·Filed 2016·Granted Jun 6, 2017·24 cites·17 claims
- 0692US10431458B2Mask shrink layer for high aspect ratio dielectric etchLAM RES CORP·Filed 2016·Granted Oct 1, 2019·11 cites·17 claims
- 0791US7632376B1Method and apparatus for atomic layer deposition (ALD) in a proximity systemLAM RES CORP·Filed 2005·Granted Dec 15, 2009·15 cites·23 claims
- 0889US7329321B2Enhanced wafer cleaning methodLAM RES CORP·Filed 2005·Granted Feb 12, 2008·13 cites·13 claims
- 0986US8317934B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2009·Granted Nov 27, 2012·10 cites·14 claims
- 1086US7239737B2User interface for quantifying wafer non-uniformities and graphically explore significanceLAM RES CORP·Filed 2002·Granted Jul 3, 2007·36 cites·22 claims
- 1184US8757177B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2012·Granted Jun 24, 2014·6 cites·17 claims
- 1283US7347915B1Plasma in-situ treatment of chemically amplified resistLAM RES CORP·Filed 2006·Granted Mar 25, 2008·8 cites·9 claims
- 1383US6744213B2Antenna for producing uniform process ratesLAM RES CORP·Filed 2003·Granted Jun 1, 2004·33 cites·19 claims
- 1483US6518705B2Method and apparatus for producing uniform process ratesLAM RES CORP·Filed 2001·Granted Feb 11, 2003·16 cites·16 claims
- 1582US8127395B2Apparatus for isolated bevel edge clean and method for using the sameYOON HYUNGSUK ALEXANDER·Filed 2006·Granted Mar 6, 2012·8 cites·14 claims
- 1682US7294580B2Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon additionLAM RES CORP·Filed 2004·Granted Nov 13, 2007·29 cites·20 claims
- 1779US7597765B2Post etch wafer surface cleaning with liquid meniscusLAM RES CORP·Filed 2006·Granted Oct 6, 2009·7 cites·15 claims
- 1878US7946303B2Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscusLAM RES CORP·Filed 2006·Granted May 24, 2011·4 cites·23 claims
- 1976US8440573B2Method and apparatus for pattern collapse free wet processing of semiconductor devicesMIKHAYLICHENKO KATRINA·Filed 2010·Granted May 14, 2013·4 cites·20 claims
- 2075US8021512B2Method of preventing premature dryingLAM RES CORP·Filed 2007·Granted Sep 20, 2011·4 cites·18 claims
- 2173US7758404B1Apparatus for cleaning edge of substrate and method for using the sameLAM RES CORP·Filed 2005·Granted Jul 20, 2010·6 cites·12 claims
- 2273US7022611B1Plasma in-situ treatment of chemically amplified resistLAM RES CORP·Filed 2003·Granted Apr 4, 2006·14 cites·4 claims
- 2373US6842147B2Method and apparatus for producing uniform processing ratesLAM RES CORP·Filed 2002·Granted Jan 11, 2005·15 cites·25 claims
- 2472US7568488B2Enhanced wafer cleaning methodLAM RES CORP·Filed 2007·Granted Aug 4, 2009·3 cites·6 claims
- 2571US9159593B2Method of particle contaminant removalKAWAGUCHI MARK NAOSHI·Filed 2009·Granted Oct 13, 2015·4 cites·18 claims
- 2658US9236279B2Method of dielectric film treatmentYUN SEOKMIN·Filed 2008·Granted Jan 12, 2016·1 cites·17 claims
- 2758US7939139B2Methods for atomic layer deposition (ALD) using a proximity meniscusLAM RES CORP·Filed 2009·Granted May 10, 2011·0 cites·13 claims
- 2855US7849554B2Apparatus and system for cleaning substrateLAM RES CORP·Filed 2009·Granted Dec 14, 2010·0 cites·23 claims
- 2954US6873112B2Method for producing a semiconductor deviceLAM RES CORP·Filed 2004·Granted Mar 29, 2005·7 cites·19 claims
- 3053US8534303B2Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscusO'DONNELL ROBERT·Filed 2011·Granted Sep 17, 2013·0 cites·20 claims
- 3153US2006011583A1Materials and gas chemistries for processing systemsBAILEY ANDREW D III·Filed 2005·Application pending·0 cites
- 3253US2004011467A1Materials and gas chemistries for processing systemsFiled 2003·Application pending·0 cites
- 3352US8105441B2Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscusO'DONNELL ROBERT·Filed 2011·Granted Jan 31, 2012·0 cites·20 claims
- 3452US2014170780A1Method of Low-K Dielectric Film RepairLAM RES CORP·Filed 2014·Application pending·0 cites
- 3551US2010015731A1Method of low-k dielectric film repairLAM RES CORP·Filed 2007·Application pending·0 cites
- 3651US2008149147A1Proximity head with configurable deliveryLAM RES·Filed 2007·Application pending·0 cites
- 3749US2012199164A1Methods for Using Proximity Head With Configurable DeliveryWILCOXSON MARK H·Filed 2012·Application pending·0 cites
- 3849US2009211596A1Method of post etch polymer residue removalLAM RES CORP·Filed 2007·Application pending·0 cites
- 3946US2010258142A1Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrateKAWAGUCHI MARK NAOSHI·Filed 2009·Application pending·0 cites
- 4043US2003145952A1Method and apparatus for producing uniform process ratesLAM RES CORP·Filed 2002·Application pending·0 cites
- 4143US2012115332A1Method of Post Etch Polymer Residue RemovalYUN SEOKMIN·Filed 2012·Application pending·0 cites
- 4241US2018286642A1Electrostatic chuck with flexible wafer temperature controlLAM RES CORP·Filed 2018·Application pending·0 cites
- 4340US8900374B2Method for substrate cleaning including movement of substrate below substrate cleaning moduleLIN CHENG-YU SEAN·Filed 2010·Granted Dec 2, 2014·0 cites·16 claims
- 4440US8828145B2Method of particle contaminant removalSABBA YIZHAK·Filed 2009·Granted Sep 9, 2014·0 cites·10 claims
- 4539US8277675B2Method of damaged low-k dielectric film layer removalYUN SEOKMIN·Filed 2006·Granted Oct 2, 2012·0 cites·17 claims
- 4633US2011139183A1System and method of preventing pattern collapse using low surface tension fluidMIKHAYLICHENKO KATRINA·Filed 2010·Application pending·0 cites
- 4731US2003155079A1Plasma processing system with dynamic gas distribution controlFiled 1999·Application pending·0 cites
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