Inventor · disambiguated record
Frederick P. Layman
Also filed as: LAYMAN FREDERICK P · LAYMAN FREDERICK PAUL
23 granted patents·6 pending applications·1,111 citations·filing 1986–2015
97Inventor score
Files withSDCMATERIALS INC9TOKYO ELECTRON LTD6BIBERGER MAXIMILIAN A3LAYMAN FREDERICK P3VARIAN ASSOCIATES3
Top patents by PatentIndex Score
29 records- 0199US8051724B1Long cool-down tube with air input jointsSDCMATERIALS INC·Filed 2008·Granted Nov 8, 2011·62 cites·21 claims
- 0299US7897127B2Collecting particles from a fluid stream via thermophoresisSDCMATERIALS INC·Filed 2008·Granted Mar 1, 2011·75 cites·20 claims
- 0398US9216398B2Method and apparatus for making uniform and ultrasmall nanoparticlesSDCMATERIALS INC·Filed 2014·Granted Dec 22, 2015·19 cites·22 claims
- 0498US8893651B1Plasma-arc vaporization chamber with wide boreBIBERGER MAXIMILIAN A·Filed 2008·Granted Nov 25, 2014·28 cites·11 claims
- 0598US8142619B2Shape of cone and air input annulusLAYMAN FREDERICK P·Filed 2008·Granted Mar 27, 2012·72 cites·11 claims
- 0697US4764076AValve incorporating wafer handling armVARIAN ASSOCIATES·Filed 1986·Granted Aug 16, 1988·399 cites·12 claims
- 0795US8828328B1Methods and apparatuses for nano-materials powder treatment and preservationLEAMON DAVID·Filed 2010·Granted Sep 9, 2014·23 cites·16 claims
- 0894US9599405B2Highly turbulent quench chamberSDCMATERIALS INC·Filed 2015·Granted Mar 21, 2017·3 cites·13 claims
- 0994US9180423B2Highly turbulent quench chamberBIBERGER MAXIMILIAN A·Filed 2008·Granted Nov 10, 2015·23 cites·16 claims
- 1093US8906316B2Fluid recirculation system for use in vapor phase particle production systemSDCMATERIALS INC·Filed 2013·Granted Dec 9, 2014·4 cites·20 claims
- 1192US4705951AWafer processing systemVARIAN ASSOCIATES·Filed 1986·Granted Nov 10, 1987·169 cites·16 claims
- 1290US9719727B2Fluid recirculation system for use in vapor phase particle production systemSDCMATERIALS INC·Filed 2014·Granted Aug 1, 2017·2 cites·9 claims
- 1390US6736149B2Method and apparatus for supercritical processing of multiple workpiecesSUPERCRITICAL SYSTEMS INC·Filed 2002·Granted May 18, 2004·45 cites·3 claims
- 1489US6921456B2High pressure processing chamber for semiconductor substrateTOKYO ELECTRON LTD·Filed 2001·Granted Jul 26, 2005·43 cites·19 claims
- 1588US8663571B2Method and apparatus for making uniform and ultrasmall nanoparticlesBIBERGER MAXIMILIAN A·Filed 2008·Granted Mar 4, 2014·5 cites·17 claims
- 1688US6926798B2Apparatus for supercritical processing of a workpieceTOKYO ELECTRON LTD·Filed 2003·Granted Aug 9, 2005·37 cites·16 claims
- 1786US8803025B2Non-plugging D.C. plasma gunLAYMAN FREDERICK P·Filed 2010·Granted Aug 12, 2014·5 cites·18 claims
- 1884US7060422B2Method of supercritical processing of a workpieceTOKYO ELECTRON LTD·Filed 2003·Granted Jun 13, 2006·27 cites·21 claims
- 1977US6926012B2Method for supercritical processing of multiple workpiecesTOKYO ELECTRON LTD·Filed 2002·Granted Aug 9, 2005·15 cites·16 claims
- 2075US7255772B2High pressure processing chamber for semiconductor substrateTOKYO ELECTRON LTD·Filed 2004·Granted Aug 14, 2007·15 cites·24 claims
- 2170US6748960B1Apparatus for supercritical processing of multiple workpiecesTOKYO ELECTRON LTD·Filed 2000·Granted Jun 15, 2004·10 cites·27 claims
- 2268US2012285548A1Long cool-down tube with air input jointsLAYMAN FREDERICK P·Filed 2011·Application pending·0 cites
- 2356US4713551ASystem for measuring the position of a wafer in a cassetteVARIAN ASSOCIATES·Filed 1986·Granted Dec 15, 1987·22 cites·4 claims
- 2456US2014263190A1High-throughput particle production using a plasma systemSDCMATERIALS INC·Filed 2014·Application pending·0 cites
- 2554USD627900SGlove boxSDCMATERIALS INC·Filed 2008·Granted Nov 23, 2010·8 cites·1 claims
- 2647US2014318318A1Non-plugging d.c. plasma gunSDCMATERAILS INC·Filed 2014·Application pending·0 cites
- 2742US2016030910A1High-throughput particle production using a plasma systemSDCMATERIALS INC·Filed 2014·Application pending·0 cites
- 2837US2004040660A1High pressure processing chamber for multiple semiconductor substratesFiled 2001·Application pending·0 cites
- 2937US2002189543A1High pressure processing chamber for semiconductor substrate including flow enhancing featuresFiled 2002·Application pending·0 cites
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