Inventor · disambiguated record
Mitsuaki Toda
Also filed as: TODA MITSUAKI
6 granted patents·6 pending applications·4 citations·filing 2010–2020
68Inventor score
Top patents by PatentIndex Score
12 records- 0168US8921706B2Component-embedded substrate, and method of manufacturing the component-embedded substrateTODA MITSUAKI·Filed 2010·Granted Dec 30, 2014·3 cites·7 claims
- 0257US9355990B2Manufacturing method of device embedded substrate and device embedded substrate manufactured by this methodMATSUMOTO TOHRU·Filed 2012·Granted May 31, 2016·1 cites·5 claims
- 0348US2015245475A1Component-embedded substrate and manufacturing method thereofMATSUMOTO TOHRU·Filed 2012·Application pending·0 cites
- 0446US2015382478A1Device embedded substrate and manufacturing method of device embedded substrateMEIKO ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0542US2014216801A1Method of manufacturing component-embedded substrate and component-embedded substrate manufactured by the sameMATSUMOTO TOHRU·Filed 2011·Application pending·0 cites
- 0642US2015257284A1Method of bending back rigid printed wiring board with flexible portionMEIKO ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0740US2016118346A1Device embedded substrate and manufacturing method thereofMEIKO ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0839US9756732B2Device embedded substrate and manufacturing method of device embedded substrateMEIKO ELECTRONICS CO LTD·Filed 2013·Granted Sep 5, 2017·0 cites·9 claims
- 0934US9793218B2Method for manufacturing device embedded substrate, and device embedded substrateMEIKO ELECTRONICS CO LTD·Filed 2013·Granted Oct 17, 2017·0 cites·12 claims
- 1032US9622352B2Manufacturing method for component incorporated substrate and component incorporated substrateMEIKO ELECTRONICS CO LTD·Filed 2012·Granted Apr 11, 2017·0 cites·4 claims
- 1129US2023143088A1Planar antenna boardMEIKO ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1224US9596765B2Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the methodYAMAKI AKIRA·Filed 2012·Granted Mar 14, 2017·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →