Inventor · disambiguated record
Ren-Shin Cheng
Also filed as: CHENG REN-SHIN
3 granted patents·1 pending application·10 citations·filing 2012–2021
58Inventor score
Files withIND TECH RES INST4
Top patents by PatentIndex Score
4 records- 0190US9706656B2Signal transmission board and method for manufacturing the sameIND TECH RES INST·Filed 2015·Granted Jul 11, 2017·9 cites·21 claims
- 0282US12027470B2Package carrier having a stiffener between solder bumpsIND TECH RES INST·Filed 2021·Granted Jul 2, 2024·1 cites·20 claims
- 0349US11239141B2Lead frame packageIND TECH RES INST·Filed 2020·Granted Feb 1, 2022·0 cites·21 claims
- 0437US2013043599A1Chip package process and chip package structureIND TECH RES INST·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →