Inventor · disambiguated record
Paul Joseph Koep
Also filed as: KOEP PAUL · KOEP PAUL J · KOEP PAUL JOSEPH
4 granted patents·3 pending applications·7 citations·filing 2007–2023
65Inventor score
Top patents by PatentIndex Score
7 records- 0184US9801285B2Solder preforms and solder alloy assembly methodsALPHA ASSEMBLY SOLUTIONS INC·Filed 2013·Granted Oct 24, 2017·5 cites·8 claims
- 0271US12388042B2Solder material and method for die attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Granted Aug 12, 2025·0 cites·15 claims
- 0352US2018020554A1Solder Preforms and Solder Alloy Assembly MethodsALPHA ASSEMBLY SOLUTIONS INC·Filed 2017·Application pending·0 cites
- 0449US11842974B2Solder material and method for die attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Dec 12, 2023·0 cites·13 claims
- 0547US10123430B2Materials for use with interconnects of electrical devices and related methodsMARCZI MICHAEL T·Filed 2007·Granted Nov 6, 2018·2 cites·8 claims
- 0633US2014328039A1Systems and methods for void reduction in a solder jointALPHA METALS·Filed 2012·Application pending·0 cites
- 0730US2017245404A1Rf shield with selectively integrated solderALPHA ASSEMBLY SOLUTIONS INC·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →