Inventor · disambiguated record
Tsutomu Takeda
Also filed as: TAKEDA TSUTOMU
9 granted patents·36 citations·filing 1997–2018
83Inventor score
Top patents by PatentIndex Score
9 records- 0182US8604357B2Wiring board having via and method forming a via in a wiring boardTAKEDA TSUTOMU·Filed 2009·Granted Dec 10, 2013·14 cites·6 claims
- 0272US8507807B2Wiring boardTAKEDA TSUTOMU·Filed 2011·Granted Aug 13, 2013·3 cites·2 claims
- 0371US9263365B2Electronic component and electronic component cooling methodNEC CORP·Filed 2014·Granted Feb 16, 2016·3 cites·9 claims
- 0464US10643976B2Electronic component, and electronic component manufacturing methodNEC CORP·Filed 2018·Granted May 5, 2020·1 cites·11 claims
- 0558US5976668ABase film for magnetic recording medium and magnetic recording medium using sameSONY CORP·Filed 1997·Granted Nov 2, 1999·14 cites·13 claims
- 0656US9028746B2Build-up welding material, deposited metal, and member with deposited metalTAKEDA TSUTOMU·Filed 2011·Granted May 12, 2015·0 cites·13 claims
- 0755US7750249B2Multilayer printed circuit board and method of manufacturing sameNEC CORP·Filed 2008·Granted Jul 6, 2010·1 cites·13 claims
- 0846US10286500B2Build-up welding material and machinery part welded with weld overlay metalKOBE STEEL LTD·Filed 2012·Granted May 14, 2019·0 cites·11 claims
- 0937US9136210B2Interposer and semiconductor deviceTAKEDA TSUTOMU·Filed 2011·Granted Sep 15, 2015·0 cites·8 claims
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