Inventor · disambiguated record
Byoung-Soo Kwak
Also filed as: KWAK BYOUNG-SOO
5 granted patents·15 citations·filing 2013–2021
73Inventor score
Top patents by PatentIndex Score
5 records- 0184US10497675B2Semiconductor device including multiple semiconductor chipsKWAK BYOUNG SOO·Filed 2016·Granted Dec 3, 2019·7 cites·14 claims
- 0274US9171825B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 27, 2015·3 cites·22 claims
- 0372US8980689B2Method of fabricating semiconductor multi-chip stack packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 17, 2015·3 cites·20 claims
- 0470US9275903B2Method of manufacturing semiconductor device substrate with crystal structure reformation regionsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 1, 2016·2 cites·19 claims
- 0553US11824006B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →