Inventor · disambiguated record
Laurent Herard
Also filed as: HERARD LAURENT
12 granted patents·4 pending applications·140 citations·filing 1998–2024
88Inventor score
Files withST MICROELECTRONICS PTE LTD10ST MICROELECTRONICS SA2ST MICROELECTRONICS ASIA1ST MICROELECTRONICS GRENOBLE 21ST MICROELECTRONICS INT NV1
Top patents by PatentIndex Score
16 records- 0192US10147834B2Overmold proximity sensor and associated methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 4, 2018·11 cites·23 claims
- 0287US6087202AProcess for manufacturing semiconductor packages comprising an integrated circuitST MICROELECTRONICS SA·Filed 1998·Granted Jul 11, 2000·114 cites·2 claims
- 0382US12356743B2Slanted glass edge for image sensor packageST MICROELECTRONICS PTE LTD·Filed 2024·Granted Jul 8, 2025·0 cites·17 claims
- 0480US10038108B2Glue bleeding prevention cap for optical sensor packagesST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 31, 2018·3 cites·23 claims
- 0580US9013017B2Method for making image sensors using wafer-level processing and associated devicesST MICROELECTRONICS ASIA·Filed 2012·Granted Apr 21, 2015·4 cites·24 claims
- 0676US11193821B2Ambient light sensor with light protectionST MICROELECTRONICS PTE LTD·Filed 2018·Granted Dec 7, 2021·2 cites·20 claims
- 0769US11942496B2Slanted glass edge for image sensor packageST MICROELECTRONICS PTE LTD·Filed 2021·Granted Mar 26, 2024·0 cites·32 claims
- 0859US12322684B2Method of manufacturing electronic devices and corresponding electronic deviceST MICROELECTRONICS SRL·Filed 2022·Granted Jun 3, 2025·0 cites·14 claims
- 0958US8937774B2Method for making paired lenses with an opaque barrier between, and product madeST MICROELECTRONICS PTE LTD·Filed 2012·Granted Jan 20, 2015·1 cites·16 claims
- 1054US10355146B2Glue bleeding prevention cap for optical sensor packagesST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jul 16, 2019·0 cites·22 claims
- 1154US2024186195A1Method for manufacturing several integrated circuit packagesST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 1250US7288843B2Integrated circuit chip support substrate for placing in a mold, and associated methodST MICROELECTRONICS SA·Filed 2002·Granted Oct 30, 2007·5 cites·8 claims
- 1348US11502029B2Thin semiconductor chip using a dummy sidewall layerST MICROELECTRONICS PTE LTD·Filed 2020·Granted Nov 15, 2022·0 cites·19 claims
- 1441US2019319157A1Electronic device comprising electronic chipsST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 1541US2014061447A1Radiation sensorST MICROELECTRONICS PTE LTD·Filed 2013·Application pending·0 cites
- 1634US2017186644A1Method for making an integrated circuit (ic) package with an electrically conductive shield layerST MICROELECTRONICS PTE LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →