Inventor · disambiguated record

Jia-Fong Yeh

Also filed as: Yeh Jia-Fong

3 granted patents·4 citations·filing 2017–2020

57Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD3

Top patents by PatentIndex Score

3 records

0175US9978673B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted May 22, 2018·3 cites·26 claims
0267US10872847B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Dec 22, 2020·1 cites·10 claims
0363US11404361B2Method for fabricating package structure having encapsulate sensing chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·12 claims

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