Inventor · disambiguated record
Kapil Heramb Sahasrabudhe
Also filed as: SAHASRABUDHE KAPIL · SAHASRABUDHE KAPIL H · SAHASRABUDHE KAPIL HERAMB
5 granted patents·4 pending applications·42 citations·filing 2008–2023
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0190US7838988B1Stud bumps as local heat sinks during transient power operationsTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 23, 2010·18 cites·12 claims
- 0283US7821113B2Leadframe having delamination resistant die padTEXAS INSTRUMENTS INC·Filed 2008·Granted Oct 26, 2010·11 cites·9 claims
- 0380US8129224B2Stud bumps as local heat sinks during transient power operationsGURRUM SIVA P·Filed 2010·Granted Mar 6, 2012·7 cites·11 claims
- 0462US8154109B2Leadframe having delamination resistant die padSAHASRABUDHE KAPIL H·Filed 2010·Granted Apr 10, 2012·2 cites·11 claims
- 0562US8102038B2Semiconductor chip attach configuration having improved thermal characteristicsSAHASRABUDHE KAPIL HERAMB·Filed 2009·Granted Jan 24, 2012·4 cites·21 claims
- 0655US2024404929A1Electronic device with wafer level capacitorTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0746US2017051388A1Mask-Less Selective Plating of LeadframeTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 0845US2013025745A1Mask-Less Selective Plating of LeadframesTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 0937US2012094441A1Semiconductor Chip Attach Configuration Having Improved Thermal CharacteristicsSAHASRABUDHE KAPIL HERAMB·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →