Inventor · disambiguated record

Dahchung Oweyang

Also filed as: OWEYANG DAHCHUNG

1 granted patent·2 citations·filing 2003–2003

17Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

1 record

0143US7094686B2Contact hole printing by packing and unpackingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 22, 2006·2 cites·15 claims

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