Inventor · disambiguated record
Shingo Masuko
Also filed as: MASUKO SHINGO
13 granted patents·11 pending applications·42 citations·filing 2004–2018
88Inventor score
Top patents by PatentIndex Score
24 records- 0170US8558244B2Semiconductor device and method for manufacturing semiconductor deviceYANASE NAOKO·Filed 2011·Granted Oct 15, 2013·3 cites·9 claims
- 0268US10784165B2Semiconductor device and dicing methodTOSHIBA KK·Filed 2018·Granted Sep 22, 2020·1 cites·7 claims
- 0363US7180228B2Surface acoustic wave device, package for the device, and method of fabricating the deviceFUJITSU MEDIA DEVICES LTD·Filed 2004·Granted Feb 20, 2007·10 cites·1 claims
- 0461US7304417B2Package for electronic device, base substrate, electronic device and fabrication method thereofFUJITSU MEDIA DEVICES LTD·Filed 2004·Granted Dec 4, 2007·10 cites·13 claims
- 0556US7528522B2Surface acoustic wave device, package for the device, and method of fabricating the deviceFUJITSU MEDIA DEVICES LTD·Filed 2004·Granted May 5, 2009·7 cites·10 claims
- 0655US8916881B2Semiconductor device and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Granted Dec 23, 2014·0 cites·7 claims
- 0755US7200924B2Method of packaging electronic partsFUJITSU MEDIA DEVICES LTD·Filed 2004·Granted Apr 10, 2007·7 cites·13 claims
- 0849US2009302716A1Piezoelectric deviceTOSHIBA KK·Filed 2009·Application pending·0 cites
- 0947US7215065B2Surface acoustic wave device, package for the device, and method of fabricating the deviceFUJITSU MEDIA DEVICES LTD·Filed 2004·Granted May 8, 2007·4 cites·5 claims
- 1045US9953894B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2017·Granted Apr 24, 2018·0 cites·6 claims
- 1145US9412825B2Semiconductor deviceTOSHIBA KK·Filed 2014·Granted Aug 9, 2016·0 cites·11 claims
- 1243US2015263630A1Power supply circuitTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1343US2014283618A1Semiconductor device and strain monitorTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1442US9472467B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2015·Granted Oct 18, 2016·0 cites·20 claims
- 1542US9054171B2HEMT semiconductor deviceTOSHIBA KK·Filed 2014·Granted Jun 9, 2015·0 cites·16 claims
- 1641US2015076506A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1741US2015263700A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1841US2015263101A1Semiconductor device and method of manufacturing sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1939US9966311B2Semiconductor device manufacturing methodTOSHIBA KK·Filed 2016·Granted May 8, 2018·0 cites·20 claims
- 2038US2007247260A1Electronic deviceTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2133US2005104192A1Electronic deviceFiled 2004·Application pending·0 cites
- 2233US2016211225A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2333US2016218067A1Semiconductor device and method of manufacturing the semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2432US2016079120A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Application pending·0 cites
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