Inventor · disambiguated record
Su-Tsai Lu
Also filed as: LU SU-TSAI
28 granted patents·4 pending applications·101 citations·filing 2004–2015
95Inventor score
Top patents by PatentIndex Score
32 records- 0188US9184153B2Chip stack structure and method for fabricating the sameLU SU-TSAI·Filed 2012·Granted Nov 10, 2015·15 cites·16 claims
- 0286US9579878B1Gravure printing system and method of using the sameIND TECH RES INST·Filed 2015·Granted Feb 28, 2017·3 cites·21 claims
- 0385US7988808B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2008·Granted Aug 2, 2011·11 cites·6 claims
- 0482US10001889B2Mesh electrode, sensing device, and electrode layerIND TECH RES INST·Filed 2015·Granted Jun 19, 2018·4 cites·14 claims
- 0582US9052789B2Touch structure and manufacturing method for the sameIND TECH RES INST·Filed 2013·Granted Jun 9, 2015·5 cites·10 claims
- 0682US8134823B2Stacked capacitor structure and manufacturing method thereofCHEN WEN-HWA·Filed 2009·Granted Mar 13, 2012·17 cites·7 claims
- 0781US7423348B2Chip structure and chip package structureIND TECH RES INST·Filed 2005·Granted Sep 9, 2008·10 cites·18 claims
- 0875US9921699B2Conductive line structure and sensing device using the sameIND TECH RES INST·Filed 2015·Granted Mar 20, 2018·2 cites·26 claims
- 0972US9606679B2Touch panel and manufacturing method thereof and touch display panelIND TECH RES INST·Filed 2013·Granted Mar 28, 2017·4 cites·21 claims
- 1072US9224790B2Illumination deviceIND TECH RES INST·Filed 2014·Granted Dec 29, 2015·2 cites·18 claims
- 1172US7960830B2Electronic assembly having a multilayer adhesive structureIND TECH RES INST·Filed 2008·Granted Jun 14, 2011·5 cites·24 claims
- 1271US7239027B2Bonding structure of device packagingIND TECH RES INST·Filed 2005·Granted Jul 3, 2007·5 cites·18 claims
- 1365US8227915B2Bump structure, chip package structure including the same and method of manufacturing the sameLU SU TSAI·Filed 2009·Granted Jul 24, 2012·3 cites·13 claims
- 1465US7183494B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2004·Granted Feb 27, 2007·3 cites·14 claims
- 1564US9448672B2Touch panel structure and fabrication method for the sameIND TECH RES INST·Filed 2013·Granted Sep 20, 2016·2 cites·19 claims
- 1664US7999350B2Electrode structure of memory capacitorIND TECH RES INST·Filed 2008·Granted Aug 16, 2011·3 cites·10 claims
- 1763US7465603B2Wafer level package structure of optical-electronic device and method for making the sameIND TECH RES INST·Filed 2007·Granted Dec 16, 2008·2 cites·6 claims
- 1863US7459055B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2006·Granted Dec 2, 2008·2 cites·9 claims
- 1955US8604613B2Electronic assembly having a multilayer adhesive structureLU SU-TSAI·Filed 2008·Granted Dec 10, 2013·1 cites·14 claims
- 2053US8134230B2Sealed joint structure of device and process using the sameYANG TSUNG-FU·Filed 2009·Granted Mar 13, 2012·2 cites·30 claims
- 2149US9395072B2Illumination deviceIND TECH RES INST·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 2248US7446421B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2007·Granted Nov 4, 2008·0 cites·20 claims
- 2346US7317235B2Wafer level package structure of optical-electronic device and method for making the sameIND TECH RES INST·Filed 2005·Granted Jan 8, 2008·0 cites·5 claims
- 2446US2009008792A1Three-dimensional chip-stack package and active component on a substrateIND TECH RES INST·Filed 2008·Application pending·0 cites
- 2545US7378746B2Composite bumpIND TECH RES INST·Filed 2006·Granted May 27, 2008·0 cites·17 claims
- 2645US2010207266A1Chip package structureIND TECH RES INST·Filed 2009·Application pending·0 cites
- 2743US9811222B2Sensing structureIND TECH RES INST·Filed 2015·Granted Nov 7, 2017·0 cites·33 claims
- 2841US8415795B2Semiconductor device and assembling method thereofLIN YU-MIN·Filed 2011·Granted Apr 9, 2013·0 cites·14 claims
- 2940US8384215B2Wafer level molding structureIND TECH RES INST·Filed 2010·Granted Feb 26, 2013·0 cites·26 claims
- 3040US2009184393A1Memory capacitor and manufacturing method thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 3136US8598686B2Electronic device package structure with a hydrophilic protection layer and method for fabricating the sameCHANG TAO-CHIH·Filed 2010·Granted Dec 3, 2013·0 cites·25 claims
- 3235US2016139708A1Touch panelIND TECH RES INST·Filed 2015·Application pending·0 cites
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