Inventor · disambiguated record
Noboru Fujino
Also filed as: FUJINO NOBORU
14 granted patents·2 pending applications·246 citations·filing 1990–2017
93Inventor score
Top patents by PatentIndex Score
16 records- 0188US7210825B2Light source deviceVICTOR COMPANY OF JAPAN·Filed 2003·Granted May 1, 2007·56 cites·11 claims
- 0284US5136948AMarking method and apparatusSHINKAWA KK·Filed 1990·Granted Aug 11, 1992·25 cites·2 claims
- 0382US5134932ASelf adjusting printing device and methodSHINKAWA KK·Filed 1990·Granted Aug 4, 1992·32 cites·4 claims
- 0471US7350926B2Light source apparatus and an image display apparatusVICTOR COMPANY OF JAPAN·Filed 2005·Granted Apr 1, 2008·10 cites·2 claims
- 0563US5181646ALead frame holding apparatus for use in wire bondersSHINKAWA KK·Filed 1992·Granted Jan 26, 1993·33 cites·2 claims
- 0658US8619371B2Plastic lensFUJINO NOBORU·Filed 2011·Granted Dec 31, 2013·2 cites·10 claims
- 0758US5372233AConveying method and a conveyor control deviceSHINKAWA KK·Filed 1993·Granted Dec 13, 1994·18 cites·6 claims
- 0855US6244493B1Die bonding apparatusSHINKAWA KK·Filed 1998·Granted Jun 12, 2001·22 cites·7 claims
- 0953US5143510ALead frame separating deviceSHINKAWA KK·Filed 1990·Granted Sep 1, 1992·17 cites·2 claims
- 1051US5237924AMethod of printing on workpieces of differing thicknessesSHINKAWA KK·Filed 1992·Granted Aug 24, 1993·10 cites·1 claims
- 1147US2010078125A1Method for securing a curved circuit board in die bonder and recording medium containing program for securing a curved circuit board in die bonderSHINKAWA KK·Filed 2008·Application pending·0 cites
- 1245US5088401AMarking method and apparatusSHINKAWA KK·Filed 1990·Granted Feb 18, 1992·10 cites·3 claims
- 1345US2009101282A1Apparatus and method for picking-up semiconductor diesSHINKAWA KK·Filed 2008·Application pending·0 cites
- 1441US5501565ADevice for storing thin plate-form partsSHINKAWA KK·Filed 1995·Granted Mar 26, 1996·6 cites·2 claims
- 1538US11257781B2Method for calibrating wire clamp deviceSHINKAWA KK·Filed 2017·Granted Feb 22, 2022·0 cites·2 claims
- 1637US5307420AMethod and apparatus for monitoring plates in marking deviceSHINKAWA KK·Filed 1992·Granted Apr 26, 1994·5 cites·2 claims
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