Inventor · disambiguated record
Jia-Shing Jan
Also filed as: JAN JIA-SHING
2 granted patents·1 pending application·1 citations·filing 2002–2002
30Inventor score
Technology areasH10P
Files withWINBOND ELECTRONICS CORP2
Top patents by PatentIndex Score
3 records- 0137US6852641B2Method of spiking mixed acid liquid in reactorWINBOND ELECTRONICS CORP·Filed 2002·Granted Feb 8, 2005·1 cites·4 claims
- 0229US6780780B2Method for removing Si-needles of waferWINBOND ELECTRONICS CORP·Filed 2002·Granted Aug 24, 2004·0 cites·18 claims
- 0325US2003140948A1Clean equipment for removing polymer residues on sidewalls of metal lines and method thereofFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →