Inventor · disambiguated record
Mitsuo Iimura
Also filed as: IIMURA MITSUO
2 granted patents·16 citations·filing 2000–2000
58Inventor score
Files withNITTO DENKO CORP2
Top patents by PatentIndex Score
2 records- 0170US6284565B1Method of resin-encapsulating semiconductor chip and mold-releasing film used for the methodNITTO DENKO CORP·Filed 2000·Granted Sep 4, 2001·10 cites·5 claims
- 0251US6270879B1Release member for use in producing a multi-layer printed wiring boardNITTO DENKO CORP·Filed 2000·Granted Aug 7, 2001·6 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →