Inventor · disambiguated record
Wen-Chou Vincent Wang
Also filed as: WANG WEN-CHOU · WANG WEN-CHOU V · WANG WEN-CHOU VINCENT
59 granted patents·2 pending applications·5,489 citations·filing 1992–2010
99Inventor score
Top patents by PatentIndex Score
61 records- 0199US6684007B2Optical coupling structures and the fabrication processesFUJITSU LTD·Filed 2001·Granted Jan 27, 2004·249 cites·4 claims
- 0299US6444921B1Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the likeFUJITSU LTD·Filed 2000·Granted Sep 3, 2002·200 cites·39 claims
- 0398US6690845B1Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 2000·Granted Feb 10, 2004·334 cites·19 claims
- 0498US6343171B1Systems based on opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 29, 2002·429 cites·26 claims
- 0598US6239485B1Reduced cross-talk noise high density signal interposer with power and ground wrapFUJITSU LTD·Filed 1999·Granted May 29, 2001·194 cites·6 claims
- 0698US6187652B1Method of fabrication of multiple-layer high density substrateFUJITSU LTD·Filed 1998·Granted Feb 13, 2001·177 cites·18 claims
- 0798US6050832AChip and board stress relief interposerFUJITSU LTD·Filed 1998·Granted Apr 18, 2000·221 cites·17 claims
- 0897US6845184B1Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 18, 2005·286 cites·25 claims
- 0997US6785447B2Single and multilayer waveguides and fabrication processFUJITSU LTD·Filed 2001·Granted Aug 31, 2004·143 cites·7 claims
- 1097US5454161AThrough hole interconnect substrate fabrication processFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·256 cites·26 claims
- 1196US6882045B2Multi-chip module and method for forming and method for deplating defective capacitorsFiled 2001·Granted Apr 19, 2005·99 cites·9 claims
- 1296US6706546B2Optical reflective structures and method for makingFUJITSU LTD·Filed 2001·Granted Mar 16, 2004·143 cites·38 claims
- 1396US6611635B1Opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Aug 26, 2003·193 cites·45 claims
- 1496US5854534AControlled impedence interposer substrateFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·238 cites·23 claims
- 1595US6669801B2Device transfer methodFUJITSU LTD·Filed 2001·Granted Dec 30, 2003·106 cites·67 claims
- 1694US7585702B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2005·Granted Sep 8, 2009·38 cites·12 claims
- 1794US7144756B1Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrateALTERA CORP·Filed 2005·Granted Dec 5, 2006·32 cites·13 claims
- 1894US6733685B2Methods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 2001·Granted May 11, 2004·64 cites·14 claims
- 1994US5419038AMethod for fabricating thin-film interconnectorFUJITSU LTD·Filed 1993·Granted May 30, 1995·96 cites·33 claims
- 2093US7602062B1Package substrate with dual material build-up layersALTERA CORP·Filed 2005·Granted Oct 13, 2009·21 cites·16 claims
- 2193US5660957AElectron-beam treatment procedure for patterned mask layersFUJITSU LTD·Filed 1996·Granted Aug 26, 1997·135 cites·10 claims
- 2292US5514906AApparatus for cooling semiconductor chips in multichip modulesFUJITSU LTD·Filed 1993·Granted May 7, 1996·158 cites·40 claims
- 2392US5426563AThree-dimensional multichip moduleFUJITSU LTD·Filed 1993·Granted Jun 20, 1995·127 cites·28 claims
- 2491US5474458AInterconnect carriers having high-density vertical connectors and methods for making the sameFUJITSU LTD·Filed 1993·Granted Dec 12, 1995·136 cites·33 claims
- 2590US6662443B2Method of fabricating a substrate with a via connectionFUJITSU LTD·Filed 2001·Granted Dec 16, 2003·47 cites·46 claims
- 2690US6168972B1Flip chip pre-assembly underfill processFUJITSU LTD·Filed 1998·Granted Jan 2, 2001·108 cites·20 claims
- 2790US5655290AMethod for making a three-dimensional multichip moduleFUJITSU LTD·Filed 1995·Granted Aug 12, 1997·105 cites·7 claims
- 2889US6949404B1Flip chip package with warpage controlALTERA CORP·Filed 2002·Granted Sep 27, 2005·65 cites·23 claims
- 2989US5722162AFabrication procedure for a stable postFUJITSU LTD·Filed 1995·Granted Mar 3, 1998·97 cites·16 claims
- 3089US5544017AMultichip module substrateFUJITSU LTD·Filed 1994·Granted Aug 6, 1996·91 cites·14 claims
- 3188US6773958B1Integrated assembly-underfill flip chip processALTERA CORP·Filed 2002·Granted Aug 10, 2004·45 cites·12 claims
- 3287US6909176B1Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrateALTERA CORP·Filed 2003·Granted Jun 21, 2005·41 cites·14 claims
- 3386US6081026AHigh density signal interposer with power and ground wrapFUJITSU LTD·Filed 1998·Granted Jun 27, 2000·61 cites·6 claims
- 3486US5404265AInterconnect capacitorsFUJITSU LTD·Filed 1992·Granted Apr 4, 1995·85 cites·16 claims
- 3585US6102710AControlled impedance interposer substrate and method of makingFUJITSU LTD·Filed 1998·Granted Aug 15, 2000·68 cites·18 claims
- 3682US8212353B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateWANG WEN-CHOU VINCENT·Filed 2010·Granted Jul 3, 2012·8 cites·14 claims
- 3782US7741160B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2009·Granted Jun 22, 2010·9 cites·6 claims
- 3880US5455064AProcess for fabricating a substrate with thin film capacitor and insulating plugFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·57 cites·4 claims
- 3979US8163642B1Package substrate with dual material build-up layersWANG WEN-CHOU·Filed 2009·Granted Apr 24, 2012·8 cites·20 claims
- 4078US5656414AMethods of forming tall, high-aspect ratio vias and trenches in photo-imageable materials, photoresist materials, and the likeFUJITSU LTD·Filed 1993·Granted Aug 12, 1997·32 cites·20 claims
- 4177US5891354AMethods of etching through wafers and substrates with a composite etch stop layerFUJITSU LTD·Filed 1996·Granted Apr 6, 1999·50 cites·20 claims
- 4275US7148569B1Pad surface finish for high routing density substrate of BGA packagesALTERA CORP·Filed 2004·Granted Dec 12, 2006·20 cites·10 claims
- 4375US6428942B1Multilayer circuit structure build up methodFUJITSU LTD·Filed 1999·Granted Aug 6, 2002·32 cites·63 claims
- 4474US5916453AMethods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 1996·Granted Jun 29, 1999·38 cites·22 claims
- 4574US5817533AHigh-yield methods of fabricating large substrate capacitorsFUJITSU LTD·Filed 1996·Granted Oct 6, 1998·43 cites·26 claims
- 4671US5789140AMethod of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residueFUJITSU LTD·Filed 1996·Granted Aug 4, 1998·25 cites·10 claims
- 4771US5382827AFunctional substrates for packaging semiconductor chipsFUJITSU LTD·Filed 1992·Granted Jan 17, 1995·44 cites·9 claims
- 4870US6543674B2Multilayer interconnection and methodFUJITSU LTD·Filed 2001·Granted Apr 8, 2003·15 cites·19 claims
- 4970US5323520AProcess for fabricating a substrate with thin film capacitorFUJITSU LTD·Filed 1993·Granted Jun 28, 1994·35 cites·26 claims
- 5068US5475262AFunctional substrates for packaging semiconductor chipsFUJITSU LTD·Filed 1993·Granted Dec 12, 1995·39 cites·13 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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