Inventor · disambiguated record
Kuniyuki Narukawa
Also filed as: NARUKAWA KUNIYUKI
2 granted patents·1 pending application·36 citations·filing 2003–2006
63Inventor score
Files withFUJITSU LTD3
Top patents by PatentIndex Score
3 records- 0172US7145241B2Semiconductor device having a multilayer interconnection structure and fabrication process thereofFUJITSU LTD·Filed 2003·Granted Dec 5, 2006·15 cites·5 claims
- 0267US6933609B2Interconnection structure and interconnection structure formation methodFUJITSU LTD·Filed 2003·Granted Aug 23, 2005·21 cites·4 claims
- 0348US2007026673A1Semiconductor device having a multilayer interconnection structure and fabrication process thereofFUJITSU LTD·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →