Inventor · disambiguated record
Duk Sang Han
Also filed as: HAN DUK SANG
1 granted patent·3 pending applications·0 citations·filing 2008–2014
11Inventor score
Files withDOOSAN CORP4
Top patents by PatentIndex Score
4 records- 0150US9957389B2Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminateDOOSAN CORP·Filed 2014·Granted May 1, 2018·0 cites·16 claims
- 0250US2009004484A1Resine Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The SameDOOSAN CORP·Filed 2008·Application pending·0 cites
- 0341US2009004488A1Resine Composition For Printed Circuit Board and Composite Substrate And Copper Laminates Using The SameDOOSAN CORP·Filed 2008·Application pending·0 cites
- 0439US2016150644A1Resin composition and laminate for printed circuit board comprising sameDOOSAN CORP·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →