Inventor · disambiguated record
Dereje Agonafer
Also filed as: AGONAFER DEREJE
10 granted patents·595 citations·filing 1987–2013
92Inventor score
Top patents by PatentIndex Score
10 records- 0197US6337794B1Isothermal heat sink with tiered cooling channelsIBM·Filed 2000·Granted Jan 8, 2002·154 cites·18 claims
- 0295US6431260B1Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereofIBM·Filed 2000·Granted Aug 13, 2002·114 cites·30 claims
- 0391US5482113AConvertible heat exchanger for air or water cooling of electronic circuit components and the likeIBM·Filed 1993·Granted Jan 9, 1996·80 cites·10 claims
- 0490US5370178AConvertible cooling module for air or water cooling of electronic circuit componentsIBM·Filed 1993·Granted Dec 6, 1994·130 cites·13 claims
- 0576US9360514B2Thermal reliability testing systems with thermal cycling and multidimensional heat transferPHAN HUY N·Filed 2013·Granted Jun 7, 2016·5 cites·16 claims
- 0672US5704419AAir flow distribution in integrated circuit spot coolersIBM·Filed 1996·Granted Jan 6, 1998·43 cites·3 claims
- 0764US5719745AExtended surface cooling for chip stack applicationsIBM·Filed 1996·Granted Feb 17, 1998·30 cites·3 claims
- 0863US10962297B2Multidimensional heat transfer system for cooling electronic componentsAGONAFER DEREJE·Filed 2012·Granted Mar 30, 2021·3 cites·20 claims
- 0952US5644687AMethods and system for thermal analysis of electronic packagesIBM·Filed 1994·Granted Jul 1, 1997·26 cites·26 claims
- 1041US4757370ACircuit package cooling technique with liquid film spreading downward across package surface without separationIBM·Filed 1987·Granted Jul 12, 1988·10 cites·3 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →