Inventor · disambiguated record
Akira Nagai
Also filed as: NAGAI AKIRA
129 granted patents·25 pending applications·2,291 citations·filing 1985–2023
99Inventor score
Files withHITACHI LTD48HITACHI CHEMICAL CO LTD29NIPPON TELEGRAPH & TELEPHONE12MITSUI HIGH TEC9MURATA MANUFACTURING CO8
Top patents by PatentIndex Score
154 records- 0196US7455901B2Fiber-reinforced composite material, method for manufacturing the same and applications thereofUNIV KYOTO·Filed 2006·Granted Nov 25, 2008·36 cites·16 claims
- 0295US7777387B2Laminated core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2007·Granted Aug 17, 2010·35 cites·16 claims
- 0394US6028364ASemiconductor device having a stress relieving mechanismHITACHI LTD·Filed 1995·Granted Feb 22, 2000·167 cites·19 claims
- 0492US8044524B2Adhesive for connection of circuit member and semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2009·Granted Oct 25, 2011·8 cites·13 claims
- 0591US8922084B2Rotor coreNAGAI AKIRA·Filed 2010·Granted Dec 30, 2014·12 cites·5 claims
- 0691US6627997B1Semiconductor module and method of mountingHITACHI LTD·Filed 1999·Granted Sep 30, 2003·124 cites·8 claims
- 0791US6621154B1Semiconductor apparatus having stress cushioning layerHITACHI LTD·Filed 2000·Granted Sep 16, 2003·65 cites·29 claims
- 0891US6223429B1Method of production of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1996·Granted May 1, 2001·145 cites·3 claims
- 0991US5021296ACircuit board and process for producing the sameHITACHI LTD·Filed 1989·Granted Jun 4, 1991·66 cites·33 claims
- 1090US8578592B2Method of manufacturing laminated rotor coreNAGAI AKIRA·Filed 2011·Granted Nov 12, 2013·14 cites·12 claims
- 1190US6670883B1Remote control system for a vehicle doorHONDA MOTOR CO LTD·Filed 2000·Granted Dec 30, 2003·66 cites·11 claims
- 1289US6114005ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1997·Granted Sep 5, 2000·98 cites·19 claims
- 1388US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 1488US5677045ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1995·Granted Oct 14, 1997·86 cites·8 claims
- 1587US7928627B2Laminated core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2010·Granted Apr 19, 2011·7 cites·3 claims
- 1687US7847466B2Laminated core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2007·Granted Dec 7, 2010·15 cites·16 claims
- 1787US6784541B2Semiconductor module and mounting method for sameHITACHI LTD·Filed 2002·Granted Aug 31, 2004·37 cites·10 claims
- 1886US8916254B2Method for manufacturing laminated core and laminated coreNAGAI AKIRA·Filed 2010·Granted Dec 23, 2014·8 cites·3 claims
- 1986US6989600B2Integrated circuit device having reduced substrate size and a method for manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Jan 24, 2006·45 cites·15 claims
- 2086US6710446B2Semiconductor device comprising stress relaxation layers and method for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·44 cites·10 claims
- 2186US6638352B2Thermal stable low elastic modulus material and device using the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·31 cites·6 claims
- 2286US4970107AComposite article comprising a copper element and a process for producing itHITACHI LTD·Filed 1989·Granted Nov 13, 1990·50 cites·34 claims
- 2385US9431883B2Method of manufacturing laminated core having permanent magnets sealed with resinMATSUBAYASHI SATOSHI·Filed 2012·Granted Aug 30, 2016·7 cites·14 claims
- 2484US9947464B2Method of manufacturing laminated coreNAGAI AKIRA·Filed 2011·Granted Apr 17, 2018·5 cites·5 claims
- 2584US8034659B2Production method of semiconductor device and bonding filmHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 11, 2011·12 cites·13 claims
- 2683US7691473B2Fiber-reinforced composite material, method for manufacturing the same, and applications thereofROHM CO LTD·Filed 2008·Granted Apr 6, 2010·4 cites·18 claims
- 2783US6423571B2Method of making a semiconductor device having a stress relieving mechanismHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·19 claims
- 2882US10418886B2Method for manufacturing laminated coreMITSUI HIGH TEC·Filed 2015·Granted Sep 17, 2019·4 cites·24 claims
- 2982US9564790B2Method for manufacturing laminated coreMITSUI HIGH TEC INC·Filed 2013·Granted Feb 7, 2017·5 cites·8 claims
- 3082US7879445B2Adhesive for bonding circuit members, circuit board and process for its productionHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·8 cites·9 claims
- 3181US10848039B2Method of manufacturing laminated rotor coreMITSUI HIGH TEC·Filed 2017·Granted Nov 24, 2020·2 cites·16 claims
- 3281US10283264B2Method of manufacturing laminated coreMITSUI HIGH TEC·Filed 2018·Granted May 7, 2019·1 cites·5 claims
- 3381US9318923B2Laminated iron core and method for manufacturing sameNAGAI AKIRA·Filed 2012·Granted Apr 19, 2016·5 cites·10 claims
- 3481US6778065B1Remote control system for a vehicleHONDA MOTOR CO LTD·Filed 2000·Granted Aug 17, 2004·54 cites·6 claims
- 3580US6940162B2Semiconductor module and mounting method for sameRENESAS TECH CORP·Filed 2004·Granted Sep 6, 2005·23 cites·24 claims
- 3680US6184577B1Electronic component parts deviceHITACHI CHEMICAL CO LTD·Filed 1997·Granted Feb 6, 2001·62 cites·8 claims
- 3778US6573615B1Electronic key system for a vehicleHONDA MOTOR CO LTD·Filed 2000·Granted Jun 3, 2003·50 cites·8 claims
- 3878US6328844B1Filmy adhesive for connecting circuits and circuit boardHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 11, 2001·53 cites·26 claims
- 3977US6348741B1Semiconductor apparatus and a manufacturing method thereofHITACHI LTD·Filed 2000·Granted Feb 19, 2002·25 cites·22 claims
- 4077US6097100AResin sealed semiconductor devices and a process for manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 1, 2000·56 cites·16 claims
- 4175US5472563APrinted circuit board and method and apparatus for making sameHITACHI LTD·Filed 1994·Granted Dec 5, 1995·40 cites·14 claims
- 4273US6998958B2Remote control system for a vehicleHONDALOCK MFG CO LTD·Filed 2004·Granted Feb 14, 2006·34 cites·4 claims
- 4371US9202622B2Welding transformer and welding transformer assembly and welding apparatusKAI KOJI·Filed 2012·Granted Dec 1, 2015·3 cites·19 claims
- 4471US7247381B1Adhesive for bonding circuit members, circuit board, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jul 24, 2007·21 cites·17 claims
- 4571US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 4670US9387608B2Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin compositionKOTANI HAYATO·Filed 2007·Granted Jul 12, 2016·2 cites·20 claims
- 4770US6396145B1Semiconductor device and method for manufacturing the same technical fieldHITACHI LTD·Filed 1998·Granted May 28, 2002·38 cites·26 claims
- 4869US11608455B2Adhesive for semiconductor device, and high productivity method for manufacturing said deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Mar 21, 2023·1 cites·14 claims
- 4969US5707749AMethod for producing thin film multilayer wiring boardHITACHI LTD·Filed 1995·Granted Jan 13, 1998·31 cites·4 claims
- 5069US5045381AThermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit boardHITACHI LTD·Filed 1989·Granted Sep 3, 1991·16 cites·8 claims
Showing the top 50 of 154 patent records by PatentIndex Score.
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