Inventor · disambiguated record

Kai-Siang Neo

Also filed as: NEO KAI-SIANG

1 granted patent·0 citations·filing 2008–2008

4Inventor score

Technology areasH10P

Files withUNITED MICROELECTRONICS CORP1

Top patents by PatentIndex Score

1 record

0142US7829472B2Method of forming at least an opening using a tri-layer structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Nov 9, 2010·0 cites·13 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →